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MCP23018x-x-MJ
16-bit I/O expander, I2C interface, open-drain outpus (with configurable pull-up resistors), 2 interrupt outputs, VQFN-24
Schematic Symbol
Pin Configuration (25 pins)
| Pin | Name | Type |
|---|---|---|
| 1 | GPB1 | bidirectional |
| 2 | GPB2 | bidirectional |
| 3 | GPB3 | bidirectional |
| 4 | GPB4 | bidirectional |
| 5 | GPB5 | bidirectional |
| 6 | GPB6 | bidirectional |
| 7 | GPB7 | bidirectional |
| 8 | V_{DD} | power_in |
| 9 | SCL | input |
| 10 | SDA | bidirectional |
| 11 | ADDR | input |
| 12 | ~{RESET} | input |
| 13 | INTB | output |
| 14 | INTA | output |
| 15 | GPA0 | bidirectional |
| 16 | GPA1 | bidirectional |
| 17 | GPA2 | bidirectional |
| 18 | GPA3 | bidirectional |
| 19 | GPA4 | bidirectional |
| 20 | GPA5 | bidirectional |
| 21 | GPA6 | bidirectional |
| 22 | GPA7 | bidirectional |
| 23 | V_{SS} | power_in |
| 24 | GPB0 | bidirectional |
| 25 | EP | passive |
Footprint
ConfirmedPackage_DFN_QFN/HVQFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Pad Layout
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2
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11
12
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25
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25
Pads (44)
| Number | Type |
|---|---|
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| — | smd |
| 1 | smd |
| 2 | smd |
| 3 | smd |
| 4 | smd |
| 5 | smd |
| 6 | smd |
| 7 | smd |
| 8 | smd |
| 9 | smd |
| 10 | smd |
| 11 | smd |
| 12 | smd |
| 13 | smd |
| 14 | smd |
| 15 | smd |
| 16 | smd |
| 17 | smd |
| 18 | smd |
| 19 | smd |
| 20 | smd |
| 21 | smd |
| 22 | smd |
| 23 | smd |
| 24 | smd |
| 25 | thru hole |
| 25 | thru hole |
| 25 | thru hole |
| 25 | thru hole |
| 25 | thru hole |
| 25 | smd |
| 25 | smd |
| 25 | thru hole |
| 25 | thru hole |
| 25 | thru hole |
| 25 | thru hole |