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7 components matching “Microcontroller”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

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CH32V003FxPx

SYMFP3D

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.

Pins
20
Pads
20
SMD
7.7×7.0

CH32V003JxMx

SYMFP3D

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios. JEITA SOIC-8 (SOP-8)

Pins
8
Pads
8
SMD
7.3×5.4

CH32V005D6U6

SYMFP3D

MCU_WCH_RiscV

QingKe 32-bit RISC-V core, 48MHz, 32KB Flash, 6KB RAM, 11 GPIO, UQFN-12

Pins
13
Pads
13
SMD
3.3×3.3

CH32V003AxMx

SYMFP—

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.

Pins
16
Pads
16
SMD
7.4×10.4

CH32V003FxUx

SYMFP—

MCU_WCH_RiscV

CH32V003 series are industrial-grade general-purpose microcontrollers designed based on 32-bit RISC-V instruction set and architecture. It adopts QingKe V2A core, RV32EC instruction set, and supports 2 levels of interrupt nesting. The series are mounted with rich peripheral interfaces and function modules. Its internal organizational structure meets the low-cost and low-power embedded application scenarios.

Pins
21
Pads
21
SMD
4.3×4.3

CH32X035G8U6

SYMFP—

MCU_WCH_RiscV

48MHz RISC-V MCU with USB PD phy (Sink, Source, DRP), USB 2.0 Full speed phy (Host, Device), 20KB RAM, 62KB Flash, WQFN-28

Pins
29
Pads
29
SMD
5.3×5.3

CH592F

SYMFP—

MCU_WCH_RiscV

RISC-V core Bluetooth LE 5.4 MCU, USB 2.0 host / device, segment LCD driver, SPI, I2C / SMBus, 4 UART, 12-bit ADC, touch-key detection module, WQFN-28

Pins
29
Pads
29
SMD
5.3×5.3