Footprints

20 footprints matching “BGA-4”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

20 footprints

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BGA-400_21.0x21.0mm_Layout20x20_P1.0mm

FP3D

Package_BGA

BGA-400, https://www.xilinx.com/support/documentation/package_specs/fg400.pdf

Pads: 400
SMD: 23.0×23.0
Boards: 1

BGA-484_23.0x23.0mm_Layout22x22_P1.0mm

FP3D

Package_BGA

BGA-484, https://www.xilinx.com/support/documentation/package_specs/fg484.pdf

Pads: 484
SMD: 25.0×25.0
Boards: 1

BGA-48_8.0x9.0mm_Layout6x8_P0.8mm

FP3D

Package_BGA

BGA-48 - pitch 0.8 mm

Pads: 48
SMD: 10.0×11.0
Boards: —

UCBGA-49_3x3mm_Layout7x7_P0.4mm

FP3D

Package_BGA

UCBGA-49, 3x3mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.latticesemi.com/view_document?document_id=213

Pads: 49
SMD: 5.0×5.0
Boards: 1

Analog_BGA-49_6.25x6.25mm_Layout7x7_P0.8mm

FP3D

Package_BGA

Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf

Pads: 49
SMD: 8.3×8.3
Boards: —

EPC_BGA-4_0.9x0.9mm_Layout2x2_P0.45mm

FP—

Package_BGA

EPC BGA-4, 0.9x09mm, Pitch 0.4mm, https://epc-co.com/epc/Portals/0/epc/documents/datasheets/EPC2035_datasheet.pdf

Pads: 4
SMD: 1.2×1.2
Boards: —

FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm

FP3D

Package_BGA

Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads: 484
SMD: 25.0×25.0
Boards: —

Infineon_TFBGA-48_6x10mm_Layout6x8_P0.75mm

FP—

Package_BGA

Cypress / Infineon TFBGA-48, NSMD, 6.0x10.0mm, 48 Ball, 6x8 Layout, 0.75mm Pitch, https://www.infineon.com/dgdl/Infineon-CY14U256LA_256-Kbit_(32_K_8)_nvSRAM-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0a9c33546

Pads: 48
SMD: 8.0×12.0
Boards: —

LFBGA-400_16x16mm_Layout20x20_P0.8mm

FP—

Package_BGA

LFBGA-400, NSMD, 16.0x16.0mm, 400 Ball, 20x20 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads: 400
SMD: 18.0×18.0
Boards: —

LFBGA-484_18x18mm_Layout22x22_P0.8mm

FP—

Package_BGA

LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf

Pads: 484
SMD: 20.0×20.0
Boards: —

Microchip_FCVG484_BGA-484_19x19mm_Layout22x22_P0.8mm

FP—

Package_BGA

FCVG484, 19.0x19.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf

Pads: 484
SMD: 21.0×21.0
Boards: —

NXP_VFBGA-42_2.6x3mm_Layout6x7_P0.4mm

FP3D

Package_BGA

NXP VFBGA-42, 2.6x3.0mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf

Pads: 42
SMD: 4.6×5.0
Boards: —

ST_LFBGA-448_18x18mm_Layout22x22_P0.8mm

FP—

Package_BGA

ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf

Pads: 448
SMD: 20.0×20.0
Boards: —

ST_TFBGA-436_18x18mm_Layout22x22_P0.8mm

FP—

Package_BGA

ST TFBGA-436, 18.0x18.0mm, 436 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=222

Pads: 436
SMD: 20.0×20.0
Boards: —

ST_VFBGA-424_14x14mm_Layout27x27_P0.5mmP0.5x0.5mm_Stagger

FP—

Package_BGA

ST VFBGA-424, 14.0x14.0mm, 424 Ball, 27x27 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf

Pads: 424
SMD: 16.0×16.0
Boards: —

Texas_DSBGA-49_3.33x3.488mm_Layout7x7_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, 3.33x3.488mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf

Pads: 49
SMD: 5.3×5.5
Boards: —