Footprints
6 footprints matching “9”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —
ST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mm
Package_CSP
ST WLCSP-20, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=105
- Pads
- 20
- SMD
- 3.9×4.4
- Boards
- —
ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger
Package_CSP
ST WLCSP-27, ST Die ID 459, 2.34x2.55mm, 27 Ball, X-staggered 9x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u031g6.pdf#page=105
- Pads
- 27
- SMD
- 4.3×4.6
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
WLCSP-9_1.21x1.22mm_Layout3x3_P0.4mm
Package_CSP
WLCSP-9, 1.21x1.22mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/wlcspcb/cb_9_3.pdf
- Pads
- 9
- SMD
- 3.2×3.2
- Boards
- —