Footprints
11 footprints matching “14”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 3
LFCSP-28-1EP_5x5mm_P0.5mm_EP3.14x3.14mm_ThermalVias
Package_CSP
LFCSP, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
NXP_SOT1450-2_WLCSP-100_5.07x5.07mm_Layout10x10_P0.5mm
Package_CSP
NXP WLCSP100 (Case SOT1450-2), 0.28mm pad, 5.07x5.07mm, 100 Ball, 10x10 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1450-2.pdf
- Pads
- 100
- SMD
- 7.1×7.1
- Boards
- —
ST_WLCSP-143_Die419
Package_CSP
WLCSP-143, 4.521x5.547mm, 143 Ball, 11x13 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f429ng.pdf#page=203
- Pads
- 143
- SMD
- 6.5×7.6
- Boards
- —
ST_WLCSP-143_Die449
Package_CSP
WLCSP-143, 4.539x5.849mm, 143 Ball, 11x13 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=202
- Pads
- 143
- SMD
- 6.5×7.9
- Boards
- —
ST_WLCSP-144_Die470
Package_CSP
WLCSP-144, 5.24x5.24mm, 144 Ball, 12x12 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00366448.pdf#page=295
- Pads
- 144
- SMD
- 7.2×7.2
- Boards
- —
ST_WLCSP-18_1.86x2.14mm_Layout7x5_P0.4mm_Stagger
Package_CSP
ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf
- Pads
- 18
- SMD
- 3.9×4.2
- Boards
- —
ST_WLCSP-49_3.14x3.14mm_Layout7x7_P0.4mm_Offcenter
Package_CSP
ST WLCSP-49, ST Die ID 01E, 3.14x3.14mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb07cc.pdf#page=62
- Pads
- 49
- SMD
- 5.1×5.1
- Boards
- —
ST_WLCSP-56_3.38x3.38mm_Layout14x8_P0.4mm_Stagger
Package_CSP
ST WLCSP-56, ST die ID 455, 3.38x3.38mm, 56 Ball, X-staggered 14x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf
- Pads
- 56
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-64_Die414
Package_CSP
WLCSP-64, 4.466x4.395mm, 64 Ball, 8x8 Layout, 0.5mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=120
- Pads
- 64
- SMD
- 6.5×6.4
- Boards
- —
