Footprints

9 footprints matching “2.4”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

9 footprints

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WLCSP-20_1.934x2.434mm_Layout4x5_P0.4mm

FP—

Package_CSP

WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf

Pads: 20
SMD: 3.9×4.4
Boards: 3

LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm

FP—

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: 1

LFCSP-16-1EP_4x4mm_P0.65mm_EP2.4x2.4mm_ThermalVias

FP—

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf)

Pads: 17
SMD: 5.3×5.3
Boards: —

LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm

FP—

Package_CSP

LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: —

LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias

FP—

Package_CSP

LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: —

ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger

FP3D

Package_CSP

ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101

Pads: 19
SMD: 3.7×4.5
Boards: —