Footprints

6 footprints matching “3x1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

6 footprints

Matched by name and keywords. Search by meaning instead

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

FP—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads: 5
SMD: 4.0×3.5
Boards: —

Analog_LFCSP-UQ-10_1.3x1.6mm_P0.4mm

FP3D

Package_CSP

Analog LFCSP-UQ, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_10_10.pdf)

Pads: 10
SMD: 2.5×2.8
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias

FP3D

Package_CSP

LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf)

Pads: 17
SMD: 4.3×4.3
Boards: —

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads: 156
SMD: 7.0×6.6
Boards: —

WLCSP-12_1.403x1.555mm_Layout6x4_P0.4mm_Stagger

FP—

Package_CSP

WLCSP-12, staggered array, 1.403x1.555mm, 12 Ball, X-staggered 6x4 Layout, 0.4mm Pitch, http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208

Pads: 12
SMD: 3.4×3.6
Boards: —