Footprints
14 footprints matching “44”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ST_WLCSP-49_Die447
Package_CSP
WLCSP-49, 3.294x3.258mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l072kz.pdf#page=134
- Pads
- 49
- SMD
- 5.3×5.3
- Boards
- 1
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
LFCSP-WD-8-1EP_3x3mm_P0.65mm_EP1.6x2.44mm_ThermalVias
Package_CSP
LFCSP-WD, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- —
NXP_SOT1444-5_WLCSP-49_3.44x3.44mm_Layout7x7_P0.4mm
Package_CSP
NXP WLCSP49 (Case SOT1444-5), 0.24mm pad, 3.44x3.44mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1444-5.pdf
- Pads
- 49
- SMD
- 5.4×5.4
- Boards
- —
ST_WLCSP-100_Die446
Package_CSP
WLCSP-100, 4.775x5.041mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f303zd.pdf#page=162
- Pads
- 100
- SMD
- 6.8×7.1
- Boards
- —
ST_WLCSP-143_Die449
Package_CSP
WLCSP-143, 4.539x5.849mm, 143 Ball, 11x13 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=202
- Pads
- 143
- SMD
- 6.5×7.9
- Boards
- —
ST_WLCSP-144_Die470
Package_CSP
WLCSP-144, 5.24x5.24mm, 144 Ball, 12x12 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00366448.pdf#page=295
- Pads
- 144
- SMD
- 7.2×7.2
- Boards
- —
ST_WLCSP-25_Die444
Package_CSP
WLCSP-25, 2.423x2.325mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=93
- Pads
- 25
- SMD
- 4.4×4.3
- Boards
- —
ST_WLCSP-36_Die440
Package_CSP
WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f051t8.pdf#page=103
- Pads
- 36
- SMD
- 4.6×4.7
- Boards
- —
ST_WLCSP-36_Die445
Package_CSP
WLCSP-36, 2.605x2.703mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=96
- Pads
- 36
- SMD
- 4.6×4.7
- Boards
- —
ST_WLCSP-49_Die448
Package_CSP
WLCSP-49, 3.277x3.109mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f071v8.pdf#page=106
- Pads
- 49
- SMD
- 5.3×5.1
- Boards
- —
ST_WLCSP-64_Die441
Package_CSP
WLCSP-64, 3.623x3.651mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/DM00213872.pdf#page=167
- Pads
- 64
- SMD
- 5.6×5.7
- Boards
- —
ST_WLCSP-64_Die442
Package_CSP
WLCSP-64, 3.347x3.585mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32f091vb.pdf#page=109
- Pads
- 64
- SMD
- 5.4×5.6
- Boards
- —
WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm
Package_CSP
WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf
- Pads
- 56
- SMD
- 5.2×5.5
- Boards
- —