Footprints

9 footprints matching “56”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

9 footprints

Matched by name and keywords. Search by meaning instead

WLCSP-12_1.56x1.56mm_P0.4mm

FP—

Package_CSP

WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf

Pads: 12
SMD: 2.1×2.1
Boards: 9

Efinix_WLCSP-80_4.4567x3.5569mm_Layout10x8_P0.4mm

FP—

Package_CSP

WLCSP-80, NSMD pad definition Page 54, 4.4567x3.5569mm, 80 Ball, 10x8 Layout, 0.4mm Pitch, https://www.efinixinc.com/docs/trion-packaging-ug-v4.9.pdf

Pads: 80
SMD: 6.5×5.6
Boards: —

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads: 57
SMD: 9.3×9.3
Boards: —

LFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mm_ThermalVias

FP—

Package_CSP

LFCSP, 56 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-56/CP_56_9.pdf)

Pads: 57
SMD: 9.3×9.3
Boards: —

ST_WLCSP-100_4.437x4.456mm_Layout10x10_P0.4mm

FP—

Package_CSP

ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf

Pads: 100
SMD: 6.4×6.5
Boards: —

ST_WLCSP-156_4.96x4.64mm_Layout13x12_P0.35mm

FP—

Package_CSP

ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf

Pads: 156
SMD: 7.0×6.6
Boards: —

ST_WLCSP-56_3.38x3.38mm_Layout14x8_P0.4mm_Stagger

FP—

Package_CSP

ST WLCSP-56, ST die ID 455, 3.38x3.38mm, 56 Ball, X-staggered 14x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u535je.pdf

Pads: 56
SMD: 5.4×5.4
Boards: —

ST_WLCSP-64_3.56x3.52mm_Layout8x8_P0.4mm

FP—

Package_CSP

ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf

Pads: 64
SMD: 5.6×5.5
Boards: —

WLCSP-56_3.170x3.444mm_Layout7x8_P0.4mm

FP—

Package_CSP

WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf

Pads: 56
SMD: 5.2×5.5
Boards: —