Footprints
264 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFN-40-1EP_5x5mm_P0.4mm_EP3.5x3.5mm
Package_DFN_QFN
TQFN, 40 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1))
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- —
TQFN-40-1EP_5x5mm_P0.4mm_EP3.5x3.5mm_ThermalVias
Package_DFN_QFN
TQFN, 40 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1))
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- —
TQFN-44-1EP_7x7mm_P0.5mm_EP4.7x4.7mm_ThermalVias
Package_DFN_QFN
TQFN, 44 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- —
TQFN-48-1EP_7x7mm_P0.5mm_EP5.1x5.1mm_ThermalVias
Package_DFN_QFN
TQFN, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
UQFN-12-1EP_2x2mm_P0.4mm_EP1.1x1.1mm
Package_DFN_QFN
UQFN, 12 Pin (https://www.wch-ic.com/download/file?id=396, https://www.wch-ic.com/downloads/CH32V006DS0_PDF.html, https://www.wch-ic.com/downloads/PACKAGE_PDF.html)
- Pads
- 13
- SMD
- 3.3×3.3
- Boards
- —
UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
UQFN-20-1EP_4x4mm_P0.5mm_EP2.8x2.8mm
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001839B.pdf#page=464)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- —
UQFN-20-1EP_4x4mm_P0.5mm_EP2.8x2.8mm_ThermalVias
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001839B.pdf#page=464)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- —
UQFN-28-1EP_4x4mm_P0.4mm_EP2.35x2.35mm
Package_DFN_QFN
UQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- —
UQFN-28-1EP_4x4mm_P0.4mm_EP2.35x2.35mm_ThermalVias
Package_DFN_QFN
UQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338)
- Pads
- 29
- SMD
- 5.2×5.2
- Boards
- —
UQFN-32_5x5mm_P0.5mm
Package_DFN_QFN
UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)
- Pads
- 32
- SMD
- 6.2×6.2
- Boards
- —
UQFN-40-1EP_5x5mm_P0.4mm_EP3.8x3.8mm_ThermalVias
Package_DFN_QFN
UQFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- —
UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm_ThermalVias
Package_DFN_QFN
UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
Vishay_PowerPAK_MLP44-24L
Package_DFN_QFN
PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)
- Pads
- 28
- SMD
- 5.1×5.1
- Boards
- —
Vishay_PowerPAK_MLP44-24L_ThermalVias
Package_DFN_QFN
PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)
- Pads
- 28
- SMD
- 5.1×5.1
- Boards
- —
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-68-1EP_8x8mm_P0.4mm_EP4.3x4.3mm
Package_DFN_QFN
VQFN, 68 Pin (https://ftdichip.com/wp-content/uploads/2025/09/DS_FT2233HP.pdf#page=49)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- —
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —