Footprints
41 footprints matching “0.5A”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 18
DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 15
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
DFN-6-1EP_2x2mm_P0.5mm_EP0.61x1.42mm
Package_DFN_QFN
DC6 Package; 6-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_6_05-08-1703.pdf)
- Pads
- 7
- SMD
- 3.1×2.6
- Boards
- 9
DFN-8_2x2mm_P0.5mm
Package_DFN_QFN
DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF
- Pads
- 8
- SMD
- 3.3×2.7
- Boards
- 9
Linear_DE14MA
Package_DFN_QFN
14-Lead Plastic DFN, 4mm x 3mm (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081731_C_DE14MA.pdf)
- Pads
- 14
- SMD
- 4.0×4.5
- Boards
- 9
WQFN-20-1EP_2.5x4.5mm_P0.5mm_EP1x2.9mm
Package_DFN_QFN
http://www.onsemi.com/pub/Collateral/510CD.PDF
- Pads
- 21
- SMD
- 4.0×6.0
- Boards
- 8
ST_UFQFPN-20_3x3mm_P0.5mm
Package_DFN_QFN
UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf)
- Pads
- 20
- SMD
- 3.5×3.5
- Boards
- 6
DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm
Package_DFN_QFN
DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)
- Pads
- 13
- SMD
- 4.1×4.6
- Boards
- 5
TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm
Package_DFN_QFN
8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 5
UDFN-10_1.35x2.6mm_P0.5mm
Package_DFN_QFN
http://www.st.com/content/ccc/resource/technical/document/datasheet/f2/11/8a/ed/40/31/40/56/DM00088292.pdf/files/DM00088292.pdf/jcr:content/translations/en.DM00088292.pdf
- Pads
- 10
- SMD
- 2.3×3.1
- Boards
- 5
DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm
Package_DFN_QFN
DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)
- Pads
- 17
- SMD
- 5.0×5.6
- Boards
- 4
DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 13
- SMD
- 4.3×3.6
- Boards
- 3
WQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
Package_DFN_QFN
QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf)
- Pads
- 33
- SMD
- 5.9×5.9
- Boards
- 3
Microsemi_QFN-40-32-2EP_6x8mm_P0.5mm
Package_DFN_QFN
40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 6x8x0.9mm Body (https://www.microsemi.com/document-portal/doc_download/131677-pd70224-data-sheet)
- Pads
- 34
- SMD
- 6.9×8.9
- Boards
- 2
QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm
Package_DFN_QFN
64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 65
- SMD
- 10.3×10.3
- Boards
- 2
UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm
Package_DFN_QFN
16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 2
DFN-10-1EP_2x3mm_P0.5mm_EP0.64x2.4mm
Package_DFN_QFN
DDB Package; 10-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf)
- Pads
- 11
- SMD
- 3.1×3.6
- Boards
- 1
DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm
Package_DFN_QFN
10-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 1
DFN-12-1EP_4x4mm_P0.5mm_EP2.66x3.38mm
Package_DFN_QFN
DF Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf)
- Pads
- 13
- SMD
- 5.0×4.6
- Boards
- 1
DFN-14-1EP_3x4mm_P0.5mm_EP1.7x3.3mm
Package_DFN_QFN
DE Package; 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf)
- Pads
- 15
- SMD
- 4.1×4.6
- Boards
- 1