Footprints

19 footprints matching “Dual”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

19 footprints

Matched by name and keywords. Search by meaning instead

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.3×3.5
Boards: 55

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 7
SMD: 3.3×2.5
Boards: 32

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 4.2×2.6
Boards: 18

DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 15

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 5

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 13
SMD: 4.3×3.6
Boards: 3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 7.2×5.7
Boards: 3

DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826)

Pads: 11
SMD: 4.3×3.5
Boards: 1

DFN-8-1EP_4x4mm_P0.8mm_EP2.39x2.21mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)

Pads: 9
SMD: 4.8×4.7
Boards: 1

DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 5.3×4.7
Boards: 1

VDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.7mm

FP3D

Package_DFN_QFN

8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 9
SMD: 3.2×2.6
Boards: 1

Microchip_DRQFN-44-1EP_5x5mm_P0.7mm_EP2.65x2.65mm

FP—

Package_DFN_QFN

QFN, 44 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf)

Pads: 45
SMD: 6.0×6.0
Boards: —

Microchip_DRQFN-44-1EP_5x5mm_P0.7mm_EP2.65x2.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 44 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf)

Pads: 45
SMD: 6.0×6.0
Boards: —

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm

FP—

Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads: 65
SMD: 8.1×8.1
Boards: —

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads: 65
SMD: 8.1×8.1
Boards: —

OnSemi_UDFN-8_1.2x1.8mm_P0.4mm

FP—

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF)

Pads: 8
SMD: 2.0×2.3
Boards: —

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: —

WDFN-6-2EP_4.0x2.6mm_P0.65mm

FP—

Package_DFN_QFN

WDFN, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF)

Pads: 8
SMD: 4.7×3.1
Boards: —