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Footprints

24 footprints matching “Microchip”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

24 footprints

Matched by name and keywords. Search by meaning instead

Microchip_8E-16

FP—

Package_DFN_QFN

16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads
17
SMD
5.0×5.0
Boards
—

Microchip_DRQFN-44-1EP_5x5mm_P0.7mm_EP2.65x2.65mm

FP—

Package_DFN_QFN

QFN, 44 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf)

Pads
45
SMD
6.0×6.0
Boards
—

Microchip_DRQFN-44-1EP_5x5mm_P0.7mm_EP2.65x2.65mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 44 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf)

Pads
45
SMD
6.0×6.0
Boards
—

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm

FP—

Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads
65
SMD
8.1×8.1
Boards
—

Microchip_DRQFN-64-1EP_7x7mm_P0.65mm_EP4.1x4.1mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 64 Pin, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf)

Pads
65
SMD
8.1×8.1
Boards
—

DFN-8-1EP_3x3mm_P0.65mm_EP1.55x2.4mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
4.3×3.5
Boards
55

DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_DFN_QFN

6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
7
SMD
3.3×2.5
Boards
32

DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
4.2×2.6
Boards
18

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
11
SMD
4.3×3.7
Boards
11

DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm

FP—

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
13
SMD
4.3×3.6
Boards
3

DFN-S-8-1EP_6x5mm_P1.27mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
7.2×5.7
Boards
3

MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm

FP—

Package_DFN_QFN

8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)

Pads
9
SMD
3.7×3.5
Boards
3

QFN-64-1EP_9x9mm_P0.5mm_EP7.35x7.35mm

FP3D

Package_DFN_QFN

64-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads
65
SMD
10.3×10.3
Boards
2

UQFN-16-1EP_3x3mm_P0.5mm_EP1.75x1.75mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads
17
SMD
4.3×4.3
Boards
2

DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm

FP3D

Package_DFN_QFN

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
5.3×4.7
Boards
1

VDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.7mm

FP3D

Package_DFN_QFN

8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads
9
SMD
3.2×2.6
Boards
1

CDFN-4_2.5x3.2mm_P2.1mm

FP—

Package_DFN_QFN

CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=16)

Pads
4
SMD
3.7×3.7
Boards
—

CDFN-4_2x2.5mm_P1.65mm

FP—

Package_DFN_QFN

CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=17)

Pads
4
SMD
3.2×3.0
Boards
—

CDFN-4_3.2x5mm_P2.54mm

FP—

Package_DFN_QFN

CDFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=15)

Pads
4
SMD
4.4×5.5
Boards
—

DFN-4_5x7mm_P5.08mm

FP—

Package_DFN_QFN

DFN, 4 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/TCG/ProductDocuments/DataSheets/DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf#page=14)

Pads
4
SMD
6.3×7.5
Boards
—

MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias

FP—

Package_DFN_QFN

8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)

Pads
9
SMD
3.7×3.5
Boards
—

UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)

Pads
17
SMD
5.3×5.3
Boards
—

WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads
9
SMD
9.2×6.5
Boards
—

WDFN-8-1EP_8x6mm_P1.27mm_EP6x4.8mm_ThermalVias

FP—

Package_DFN_QFN

WDFN, 8 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_6x8mm_MN_C04172A.pdf)

Pads
9
SMD
9.2×6.5
Boards
—