Footprints

21 footprints matching “pads”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

21 footprints

Matched by name and keywords. Search by meaning instead

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads
21
SMD
4.5×4.5
Boards
18

DFN-8_2x2mm_P0.5mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad - Ref http://pdfserv.maximintegrated.com/land_patterns/90-0349.PDF

Pads
8
SMD
3.3×2.7
Boards
9

TDFN-12_2x3mm_P0.5mm

FP—

Package_DFN_QFN

TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf

Pads
12
SMD
2.8×3.5
Boards
5

WQFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm

FP—

Package_DFN_QFN

QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf)

Pads
33
SMD
5.9×5.9
Boards
3

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads
29
SMD
5.3×5.3
Boards
2

SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm_ThermalVias

FP—

Package_DFN_QFN

20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf

Pads
21
SMD
4.5×4.5
Boards
1

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads
21
SMD
5.3×5.3
Boards
1

MLPQ-16-1EP_4x4mm_P0.65mm_EP2.8x2.8mm

FP—

Package_DFN_QFN

Micro Leadframe Package, 16 pin with exposed pad

Pads
17
SMD
5.3×5.3
Boards
—

UDC-QFN-20-4EP_3x4mm_P0.5mm_EP0.41x0.25mm

FP—

Package_DFN_QFN

UDC QFN, 20 Pin, Exposed Pad Variation AB (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081536_B_UDC20(AB).pdf), modifed from generated QFN-20-1EP_3x4mm_P0.5

Pads
24
SMD
4.3×5.3
Boards
—

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads
29
SMD
6.2×6.2
Boards
—

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads
29
SMD
6.2×6.2
Boards
—

VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from STMicroeletronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.st.com/resource/en/datasheet/stspin32f0a.pdf#page=37)

Pads
49
SMD
8.3×8.3
Boards
—

VQFN-48-1EP_7x7mm_P0.5mm_EP2.6x2.6mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from STMicroeletronics, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.st.com/resource/en/datasheet/stspin32f0a.pdf#page=37)

Pads
49
SMD
8.3×8.3
Boards
—

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)

Pads
49
SMD
8.3×8.3
Boards
—

VQFN-48-1EP_7x7mm_P0.5mm_EP4.2x4.2mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 48 Pin (Based on JEDEC MO-220 variation VKKD-2 (using Figure 1), custom Exposed Pad from NXP, https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, https://www.nxp.com/docs/en/package-information/SOT619-28.pdf)

Pads
49
SMD
8.3×8.3
Boards
—

WDFN-6-2EP_4.0x2.6mm_P0.65mm

FP—

Package_DFN_QFN

WDFN, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF)

Pads
8
SMD
4.7×3.1
Boards
—

WDFN-8_2x2mm_P0.5mm

FP—

Package_DFN_QFN

DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF)

Pads
8
SMD
2.8×2.5
Boards
—

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads
21
SMD
5.3×5.3
Boards
—

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads
29
SMD
5.3×5.3
Boards
—

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads
39
SMD
6.2×8.2
Boards
—

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads
39
SMD
6.2×8.2
Boards
—