Footprints

41 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

41 footprints · page 2 of 2

Bosch_LGA-16_4.5x3mm_P0.5mm_LayoutBorder7x1y_ClockwisePinNumbering

FP3D

Package_LGA

Bosch LGA, 16 Pin (https://www.bosch-sensortec.com/media/boschsensortec/downloads/datasheets/bst-bmi088-ds001.pdf#page=55)

Pads: 16
SMD: 5.2×3.7
Boards: 1

NXP_LGA-8_3x5mm_P1.25mm_H1.2mm

FP—

Package_LGA

NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15)

Pads: 8
SMD: 4.0×5.5
Boards: 1

AMS_LGA-20_4.7x4.5mm_P0.65mm

FP3D

Package_LGA

http://ams.com/eng/content/download/1008631/2361759/498838

Pads: 20
SMD: 6.0×6.2
Boards: —

LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y

FP3D

Package_LGA

LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)

Pads: 16
SMD: 4.5×4.5
Boards: —

LGA-8_8x6.2mm_P1.27mm

FP—

Package_LGA

LGA, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17)

Pads: 8
SMD: 9.2×6.7
Boards: —

Linear_LGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_LGA

Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads: 133
SMD: 15.5×15.5
Boards: —

MPS_LGA-18-10EP_12x12mm_P3.3mm

FP—

Package_LGA

MPS LGA-18 12x12x3.82mm (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MPM3550EGLE/document_id/5102/)

Pads: 18
SMD: 12.5×12.5
Boards: —

Nordic_nRF9151-LAxx_LGA-80-33EP_12.1x11.1mm_P0.5mm

FP—

Package_LGA

nRF9151 (https://docs.nordicsemi.com/bundle/ps_nrf9151/page/mec_spec.html)

Pads: 113
SMD: 12.6×11.6
Boards: —

Nordic_nRF9160-SIxx_LGA-102-59EP_16.0x10.5mm_P0.5mm

FP—

Package_LGA

nRF9160 (https://docs.nordicsemi.com/bundle/ps_nrf9160/page/mec_spec.html)

Pads: 127
SMD: 16.9×11.4
Boards: —

NXP_USON-8_1x1.35mm_P0.35mm

FP—

Package_LGA

NXP USON, 8 Pin (https://www.nxp.com/docs/en/package-information/SOT1203.pdf)

Pads: 8
SMD: 1.7×1.9
Boards: —

Rohm_MLGA010V020A_LGA-10_2x2mm_P0.45mm_LayoutBorder2x3y

FP—

Package_LGA

Rohm LGA, 10 Pin (https://fscdn.rohm.com/en/techdata_basic/ic/package/Jisso_MLGA010V020A-1-2_Rev005s_E2(MSL3).pdf)

Pads: 10
SMD: 2.8×2.8
Boards: —

ST_CCLGA-7L_2.8x2.8mm_P1.15mm_H1.95mm

FP—

Package_LGA

ST CCLGA, 7 Pin (https://www.st.com/resource/en/datasheet/ilps28qsw.pdf#page=44)

Pads: 7
SMD: 3.3×3.3
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008C_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias

FP—

Package_LGA

Texas SIL0008C MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82085.pdf#page=20)

Pads: 9
SMD: 3.4×3.5
Boards: —

Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm

FP—

Package_LGA

Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19)

Pads: 9
SMD: 3.3×3.5
Boards: —

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: —

ublox_LGA-53_4.5x4.5mm_Layout9x9_P0.5mm

FP—

Package_LGA

ublox MIA SoC Module, 4.5x4.5mm, 53 Ball, 9x9 Layout, 0.5mm Pitch, https://content.u-blox.com/sites/default/files/documents/MIA-M10Q_IntegrationManual_UBX-21028173.pdf#page=82

Pads: 53
SMD: 6.5×6.5
Boards: —