Footprints
235 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSO-8_6.8x5.9mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 11.2×6.4
- Boards
- 1
Analog_MSOP-12-16_3x4.039mm_P0.5mm
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)
- Pads
- 12
- SMD
- 5.6×4.5
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
Infineon_PG-DSO-20-U03_7.5x12.8mm
Package_SO
Infineon PG-DSO, 20 Pin (https://www.infineon.com/dgdl/Infineon-2ED1323S12P_2ED1324S12P-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c869190210186e92f0f506d0c)
- Pads
- 20
- SMD
- 11.8×13.3
- Boards
- —
Infineon_PG-DSO-8-24_4x5mm
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/dgdl/Infineon-BSP752R-DS-v01_02-EN.pdf?fileId=db3a304316f112290116f233cbd271e9#page=17)
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
JEITA_SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)
- Pads
- 16
- SMD
- 7.7×10.4
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- —
PSOP-44_16.9x27.17mm_P1.27mm
Package_SO
PSOP44: plastic thin shrink small outline package; 44 leads; body width 16.90 mm
- Pads
- 44
- SMD
- 19.2×28.8
- Boards
- —
SOIC-14-16_3.9x9.9mm_P1.27mm
Package_SO
SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)
- Pads
- 14
- SMD
- 7.4×10.4
- Boards
- —
SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)
- Pads
- 5
- SMD
- 8.4×4.1
- Boards
- —
SOIC-8_3.81x9.347mm_P2.54mm
Package_SO
SOIC, 8 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc2014n-datasheet?assetguid=6e3baf84-de75-4ea7-97ce-3a5e05a007c9)
- Pads
- 8
- SMD
- 7.5×9.9
- Boards
- —
SOJ-36_10.16x23.495mm_P1.27mm
Package_SO
SOJ, 36 Pin (JEDEC MS-027-A, 400 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 36
- SMD
- 12.6×24.0
- Boards
- —
SSO-8_13.6x6.3mm_P1.27mm_Clearance14.2mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 18.4×6.7
- Boards
- —