Footprints
15 footprints matching “28”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
SOIC-28W_7.5x17.9mm_P1.27mm
Package_SO
SOIC, 28 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf)
- Pads
- 28
- SMD
- 11.9×18.4
- Boards
- 186
TSSOP-28_4.4x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 7.7×10.2
- Boards
- 164
SOIC-28W_7.5x18.7mm_P1.27mm
Package_SO
SOIC, 28 Pin (https://www.es.co.th/Schemetic/PDF/AK5394A.PDF#page=23)
- Pads
- 28
- SMD
- 11.9×19.2
- Boards
- 40
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 8
SOP-28_8.4x18.16mm_P1.27mm
Package_SO
SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)
- Pads
- 28
- SMD
- 13.9×18.7
- Boards
- 8
TSOP-I-28_11.8x8mm_P0.55mm
Package_SO
TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)
- Pads
- 28
- SMD
- 14.9×8.7
- Boards
- 6
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 3
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- 2
TSSOP-28_6.1x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 9.4×10.2
- Boards
- 2
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
TSSOP-28_4.4x7.8mm_P0.5mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var BC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 7.7×8.3
- Boards
- —
TSSOP-28_6.1x7.8mm_P0.5mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var EA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 9.4×8.3
- Boards
- —
TSSOP-28_8x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var GA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 11.3×10.2
- Boards
- —