Footprints
158 footprints matching “4”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_3.9x4.9mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 3,516
SOIC-14_3.9x8.7mm_P1.27mm
Package_SO
SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 908
TSSOP-20_4.4x6.5mm_P0.65mm
Package_SO
TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 20
- SMD
- 7.7×7.0
- Boards
- 731
TSSOP-16_4.4x5mm_P0.65mm
Package_SO
TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 16
- SMD
- 7.7×5.5
- Boards
- 579
TSSOP-14_4.4x5mm_P0.65mm
Package_SO
TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 14
- SMD
- 7.7×5.5
- Boards
- 507
SO-8_3.9x4.9mm_P1.27mm
Package_SO
SO, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf)
- Pads
- 8
- SMD
- 7.4×5.4
- Boards
- 380
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
TSSOP-8_4.4x3mm_P0.65mm
Package_SO
TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 8
- SMD
- 7.7×3.5
- Boards
- 179
TSSOP-28_4.4x9.7mm_P0.65mm
Package_SO
TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 28
- SMD
- 7.7×10.2
- Boards
- 164
SO-14_3.9x8.65mm_P1.27mm
Package_SO
SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)
- Pads
- 14
- SMD
- 7.4×9.2
- Boards
- 147
SOIC-24W_7.5x15.4mm_P1.27mm
Package_SO
SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)
- Pads
- 24
- SMD
- 11.9×15.9
- Boards
- 141
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
SSOP-24_5.3x8.2mm_P0.65mm
Package_SO
SSOP, 24 Pin (JEDEC MO-150 variation AG, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=398, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-ssop/ssop_24_05-08-1640.pdf)
- Pads
- 24
- SMD
- 9.4×8.7
- Boards
- 111
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
SOIC-16_4.55x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12858&prodName=TLP291-4)
- Pads
- 16
- SMD
- 8.6×10.8
- Boards
- 64
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
SO-4_4.4x3.6mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339
- Pads
- 4
- SMD
- 8.8×4.1
- Boards
- 49
SOP-4_4.4x2.6mm_P1.27mm
Package_SO
SOP, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf)
- Pads
- 4
- SMD
- 8.5×3.1
- Boards
- 48
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
TSOP-II-44_10.16x18.41mm_P0.8mm
Package_SO
TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 44
- SMD
- 13.2×18.9
- Boards
- 47
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SOP-16_4.4x10.4mm_P1.27mm
Package_SO
SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)
- Pads
- 16
- SMD
- 8.5×10.9
- Boards
- 45
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40