Footprints
11 footprints matching “56”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
SSOP-56_7.5x18.5mm_P0.635mm
Package_SO
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)
- Pads
- 56
- SMD
- 11.1×19.1
- Boards
- 5
TSOP-I-56_18.4x14mm_P0.5mm
Package_SO
TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC)
- Pads
- 56
- SMD
- 21.5×14.5
- Boards
- 3
TSSOP-56_6.1x14mm_P0.5mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 9.4×14.5
- Boards
- 2
TSOP-I-56_14.4x14mm_P0.5mm
Package_SO
TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EA)
- Pads
- 56
- SMD
- 17.5×14.5
- Boards
- —
TSOP-I-56_16.4x14mm_P0.5mm
Package_SO
TSOP-I, 56 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB)
- Pads
- 56
- SMD
- 19.5×14.5
- Boards
- —
TSSOP-56_6.1x12.5mm_P0.4mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 9.4×13.0
- Boards
- —
TSSOP-56_8x12.5mm_P0.4mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 11.3×13.0
- Boards
- —
TSSOP-56_8x14mm_P0.5mm
Package_SO
TSSOP, 56 Pin (JEDEC MO-153 Var HD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 56
- SMD
- 11.3×14.5
- Boards
- —
VSO-56_11.1x21.5mm_P0.75mm
Package_SO
VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)
- Pads
- 56
- SMD
- 16.6×22.2
- Boards
- —