Footprints

397 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

397 footprints · page 3 of 17

Vishay_PowerPAK_1212-8_Single

FP—

Package_SO

PowerPAK 1212-8 Single (https://www.vishay.com/docs/71656/ppak12128.pdf, https://www.vishay.com/docs/72597/72597.pdf)

Pads: 5
SMD: 4.4×3.6
Boards: 39

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm_ThermalVias

FP—

Package_SO

SOIC, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8)

Pads: 9
SMD: 7.4×5.4
Boards: 38

TSSOP-48_6.1x12.5mm_P0.5mm

FP3D

Package_SO

TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 48
SMD: 9.4×13.0
Boards: 36

SO-20_5.3x12.6mm_P1.27mm

FP—

Package_SO

SO, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf)

Pads: 20
SMD: 9.4×13.1
Boards: 35

TSOP-I-48_18.4x12mm_P0.5mm

FP3D

Package_SO

TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD)

Pads: 48
SMD: 21.5×12.5
Boards: 35

SOP-4_3.8x4.1mm_P2.54mm

FP3D

Package_SO

SOP, 4 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc1017n-datasheet?assetguid=b4f177f1-629f-4104-97a5-8b8d709e83de)

Pads: 4
SMD: 7.5×4.6
Boards: 34

SSOP-8_3.9x5.05mm_P1.27mm

FP3D

Package_SO

SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)

Pads: 8
SMD: 7.4×5.6
Boards: 34

Texas_HSOP-8-1EP_3.9x4.9mm_P1.27mm_ThermalVias

FP—

Package_SO

Texas Instruments HSOP 9, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf)

Pads: 9
SMD: 7.5×5.5
Boards: 34

SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm

FP3D

Package_SO

SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)

Pads: 11
SMD: 7.5×5.4
Boards: 33

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

TI_SO-PowerPAD-8

FP3D

Package_SO

8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)

Pads: 9
SMD: 8.0×5.4
Boards: 33

SOP-16_4.55x10.3mm_P1.27mm

FP—

Package_SO

SOP, 16 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12855&prodName=TLP290-4)

Pads: 16
SMD: 8.6×10.8
Boards: 32

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias

FP—

Package_SO

HTSSOP, 16 Pin (Texas Instruments PWP0016C, based on JEDEC MO-153 variation ABT, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd023ac/pptd023ac.pdf, https://www.ti.com/lit/ds/symlink/drv8833.pdf#page=27, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 17
SMD: 7.8×5.5
Boards: 31