Footprints

12 footprints matching “05”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

12 footprints

Matched by name and keywords. Search by meaning instead

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads
8
SMD
9.3×5.8
Boards
139

TSOP-6_1.65x3.05mm_P0.95mm

FP3D

Package_SO

TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf

Pads
6
SMD
3.5×3.5
Boards
69

SSOP-8_3.9x5.05mm_P1.27mm

FP3D

Package_SO

SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)

Pads
8
SMD
7.4×5.6
Boards
34

TSOP-5_1.65x3.05mm_P0.95mm

FP3D

Package_SO

TSOP-5 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf

Pads
5
SMD
3.5×3.5
Boards
30

SOP-8_6.605x9.655mm_P2.54mm

FP3D

Package_SO

SOP, 8 Pin (https://www.onsemi.com/pdf/datasheet/hcpl2631m-d.pdf)

Pads
8
SMD
11.5×10.2
Boards
3

SOP-32_11.305x20.495mm_P1.27mm

FP—

Package_SO

SOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads
32
SMD
15.7×21.0
Boards
2

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias

FP—

Package_SO

TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)

Pads
29
SMD
7.8×10.2
Boards
1

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias

FP—

Package_SO

HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)

Pads
39
SMD
7.7×10.2
Boards
—

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm

FP—

Package_SO

TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)

Pads
29
SMD
7.7×10.2
Boards
—

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm_ThermalVias

FP—

Package_SO

TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)

Pads
29
SMD
7.7×10.2
Boards
—

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm

FP—

Package_SO

TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)

Pads
29
SMD
7.8×10.2
Boards
—