Footprints

36 footprints matching “28”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

36 footprints · page 1 of 2

Matched by name and keywords. Search by meaning instead

SSOP-28_5.3x10.2mm_P0.65mm

FP3D

Package_SO

SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)

Pads: 28
SMD: 9.4×10.7
Boards: 244

SOIC-28W_7.5x17.9mm_P1.27mm

FP3D

Package_SO

SOIC, 28 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf)

Pads: 28
SMD: 11.9×18.4
Boards: 186

TSSOP-28_4.4x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 28
SMD: 7.7×10.2
Boards: 164

SOIC-28W_7.5x18.7mm_P1.27mm

FP3D

Package_SO

SOIC, 28 Pin (https://www.es.co.th/Schemetic/PDF/AK5394A.PDF#page=23)

Pads: 28
SMD: 11.9×19.2
Boards: 40

SSOP-28_3.9x9.9mm_P0.635mm

FP3D

Package_SO

SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)

Pads: 28
SMD: 6.9×10.4
Boards: 33

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 13

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 8

SOP-28_8.4x18.16mm_P1.27mm

FP3D

Package_SO

SOP, 28 Pin (https://www.issi.com/WW/pdf/62-65C256AL.pdf#page=12)

Pads: 28
SMD: 13.9×18.7
Boards: 8

TSOP-I-28_11.8x8mm_P0.55mm

FP3D

Package_SO

TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)

Pads: 28
SMD: 14.9×8.7
Boards: 6

QSOP-28_3.9x9.9mm_P0.635mm

FP—

Package_SO

QSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)

Pads: 28
SMD: 7.4×10.4
Boards: 4

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.75x6.2mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.trinamic.com/fileadmin/assets/Support/AppNotes/AN005x-IC_Package_PCB_Footprint_Guidelines_HTSSOP28_rev1.00.pdf)

Pads: 29
SMD: 7.8×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm_ThermalVias

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 3

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: 2

TSSOP-28_6.1x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 28
SMD: 9.4×10.2
Boards: 2

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm

FP—

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF)

Pads: 29
SMD: 7.7×10.2
Boards: 2

SOJ-28_10.16x18.415mm_P1.27mm

FP—

Package_SO

SOJ, 28 Pin (JEDEC MS-027-A, 400 mils width, variation AA, https://www.jedec.org/system/files/docs/Ms-027a.pdf)

Pads: 28
SMD: 12.6×18.9
Boards: 1

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm

FP—

Package_SO

TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3762.pdf)

Pads: 29
SMD: 7.7×10.2
Boards: 1

TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias

FP—

Package_SO

TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m)

Pads: 29
SMD: 7.8×10.2
Boards: 1

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads: 29
SMD: 7.3×10.3
Boards: —

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads: 29
SMD: 8.0×10.3
Boards: —

NXP_HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.2x3.4mm_ThermalVias

FP—

Package_SO

HTSSOP, 28 Pin (https://www.nxp.com/docs/en/package-information/SOT1172-3.pdf)

Pads: 29
SMD: 8.0×10.3
Boards: —

SOJ-28_7.62x18.415mm_P1.27mm

FP—

Package_SO

SOJ, 28 Pin (JEDEC MS-023-A, 300 mils width, variation AD, https://www.jedec.org/system/files/docs/Ms-023a.pdf)

Pads: 28
SMD: 9.8×18.9
Boards: —