Footprints
7 footprints matching “3.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSOP-6_1.65x3.05mm_P0.95mm
Package_SO
TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 6
- SMD
- 3.5×3.5
- Boards
- 69
TSOP-5_1.65x3.05mm_P0.95mm
Package_SO
TSOP-5 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 5
- SMD
- 3.5×3.5
- Boards
- 30
Texas_PWP0020A
Package_SO
20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf)
- Pads
- 21
- SMD
- 8.2×7.0
- Boards
- 2
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
HTSSOP-38-1EP_4.4x9.7mm_P0.5mm_EP3.05x6.65mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (JEDEC MO-153 variation BDT-1 (with exposed pad size from Maxim / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-153, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tssop-exp/21-0714.pdf)
- Pads
- 39
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm
Package_SO
TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.05x7.56mm_ThermalVias
Package_SO
TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/38921fc.pdf)
- Pads
- 29
- SMD
- 7.7×10.2
- Boards
- —