Footprints

113 footprints

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

113 footprints · page 4 of 5

WSON-12-1EP_3x3mm_P0.5mm_EP1.5x2.5mm_ThermalVias

FP—

Package_SON

WSON, 12 Pin (https://www.ti.com/lit/ds/symlink/tps63710.pdf#page=33)

Pads: 13
SMD: 4.3×3.5
Boards: 1

WSON-12-1EP_4x4mm_P0.5mm_EP2.6x3mm_ThermalVias

FP—

Package_SON

WSON, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62)

Pads: 13
SMD: 5.3×4.5
Boards: 1

WSON-8-1EP_3x2.5mm_P0.5mm_EP1.2x1.5mm_PullBack

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf)

Pads: 9
SMD: 3.5×3.0
Boards: 1

WSON-8-1EP_4x4mm_P0.8mm_EP1.98x3mm

FP—

Package_SON

WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34)

Pads: 9
SMD: 5.3×4.5
Boards: 1

Diodes_PowerDI3333-8_UXC_3.3x3.3mm_P0.65mm

FP—

Package_SON

Diodes Incorporated PowerDI3333-8 UXC, 3.05x3.05x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8%20(Type%20UXC).pdf

Pads: 6
SMD: 4.1×3.6
Boards: —

Infineon_PG-TISON-8-2

FP—

Package_SON

Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/

Pads: 7
SMD: 7.0×5.5
Boards: —

Infineon_PG-TISON-8-3

FP—

Package_SON

Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/

Pads: 7
SMD: 7.0×5.5
Boards: —

Infineon_PG-TISON-8-4

FP—

Package_SON

Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/

Pads: 8
SMD: 7.0×5.5
Boards: —

Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm

FP3D

Package_SON

Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)

Pads: 11
SMD: 4.2×3.5
Boards: —

Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias

FP3D

Package_SON

Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)

Pads: 11
SMD: 4.2×3.5
Boards: —

MPS_USON-6_1.2x1.6mm_P0.5mm

FP—

Package_SON

MPS USON, 6 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2151/document_id/4678/#page=21)

Pads: 6
SMD: 2.5×2.1
Boards: —

MPS_VSON-6_1x1.5mm_P0.5mm

FP—

Package_SON

MPS VSON, 6 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP21148/document_id/1006/#page=14)

Pads: 6
SMD: 2.3×2.0
Boards: —

Nexperia_HUSON-12_USON-12-1EP_1.35x2.5mm_P0.4mm_EP0.4x2mm

FP3D

Package_SON

Nexperia HUSON-12 USON, 12 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)

Pads: 13
SMD: 2.6×3.0
Boards: —

Nexperia_HUSON-8_USON-8-1EP_1.35x1.7mm_P0.4mm_EP0.4x1.2mm

FP3D

Package_SON

Nexperia HUSON-8 USON, 8 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)

Pads: 9
SMD: 2.6×2.2
Boards: —

ROHM_VML0806

FP—

Package_SON

VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf)

Pads: 3
SMD: 1.4×1.2
Boards: —