Footprints

26 footprints matching “x1”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

26 footprints · page 1 of 2

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WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 94

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

USON-10_2.5x1.0mm_P0.5mm

FP3D

Package_SON

USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf

Pads: 10
SMD: 1.8×3.0
Boards: 84

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 60

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 47

Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm

FP3D

Package_SON

Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)

Pads: 9
SMD: 4.3×2.5
Boards: 39

WSON-6_1.5x1.5mm_P0.5mm

FP3D

Package_SON

WSON6, http://www.ti.com/lit/ds/symlink/tlv702.pdf

Pads: 6
SMD: 2.4×2.0
Boards: 34

Texas_X2SON-4_1x1mm_P0.65mm

FP—

Package_SON

X2SON 5 pin 1x1mm package, DQN0004A (Reference Datasheet: http://www.ti.com/lit/ds/sbvs193d/sbvs193d.pdf Reference part: TPS383x) [StepUp generated footprint]

Pads: 5
SMD: 1.8×1.5
Boards: 22

SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm

FP—

Package_SON

SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf)

Pads: 9
SMD: 3.6×2.5
Boards: 10

Texas_USON-6_1x1.45mm_P0.5mm_SMD

FP3D

Package_SON

USON, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined

Pads: 6
SMD: 1.5×2.0
Boards: 8

Texas_DPY0002A_0.6x1mm_P0.65mm

FP—

Package_SON

X1SON 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf

Pads: 2
SMD: 1.3×0.9
Boards: 7

X2SON-8_1.4x1mm_P0.35mm

FP3D

Package_SON

X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf

Pads: 8
SMD: 1.7×1.9
Boards: 7

Fairchild_MicroPak-6_1.0x1.45mm_P0.5mm

FP—

Package_SON

Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff

Pads: 6
SMD: 1.8×1.9
Boards: 2

HUSON-3-1EP_2x2mm_P1.3mm_EP1.1x1.6mm

FP—

Package_SON

HUSON, 3 Pin, SOT1061 (Ref: https://assets.nexperia.com/documents/data-sheet/PMEG2020CPA.pdf)

Pads: 3
SMD: 2.6×2.5
Boards: 2

WSON-8-1EP_3x2.5mm_P0.5mm_EP1.2x1.5mm_PullBack_ThermalVias

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf)

Pads: 9
SMD: 3.5×3.0
Boards: 2

Fairchild_MicroPak2-6_1.0x1.0mm_P0.35mm

FP—

Package_SON

Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff

Pads: 6
SMD: 1.6×1.3
Boards: 1

WSON-8-1EP_3x2.5mm_P0.5mm_EP1.2x1.5mm_PullBack

FP—

Package_SON

WSON, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf)

Pads: 9
SMD: 3.5×3.0
Boards: 1

MPS_USON-6_1.2x1.6mm_P0.5mm

FP—

Package_SON

MPS USON, 6 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2151/document_id/4678/#page=21)

Pads: 6
SMD: 2.5×2.1
Boards: —

MPS_VSON-6_1x1.5mm_P0.5mm

FP—

Package_SON

MPS VSON, 6 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP21148/document_id/1006/#page=14)

Pads: 6
SMD: 2.3×2.0
Boards: —