Footprints
11 footprints matching “3mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
AD DFN-12 3X3MM DD
celestial-altium-Leadless_DFN
DD Package 12-Lead Plastic DFN (3mm × 3mm)
- Pads
- 13
- SMD
- 4.0×3.6
- Boards
- —
ANALOG DEV DFN-10 3X3MM DD
celestial-altium-Leadless_DFN
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density
- Pads
- 11
- SMD
- 4.0×3.9
- Boards
- —
LT DFN-8 3X3MM
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×4.2
- Boards
- —
MAXIM TDFN-10 3x3MM T1033-1
celestial-altium-Leadless_DFN
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.35mm, IPC Medium Density
- Pads
- 11
- SMD
- 4.2×4.2
- Boards
- —
MAXIM TDFN-12 3X3MM TD1233+1
celestial-altium-Leadless_DFN
DFN, 12-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x2.50mm
- Pads
- 13
- SMD
- 4.2×3.6
- Boards
- —
MAXIM TDFN-14 3x3MM T1433+2
celestial-altium-Leadless_DFN
DFN, 14-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.78x2.35mm, IPC Medium Density
- Pads
- 15
- SMD
- 4.2×4.2
- Boards
- —
MICROCHIP DFN-10 3mmx3mm MF
celestial-altium-Leadless_DFN
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.34mm, IPC Medium Density
- Pads
- 11
- SMD
- 4.2×4.2
- Boards
- —
MICROCHIP DFN-8 3X3MM
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 3.00x3.00mm, Pitch 0.65mm, Thermal Pad 1.50x2.0mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×3.4
- Boards
- —
MICROCHIP TDFN-8 2X3MM
celestial-altium-Leadless_DFN
DFN, 8-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.40x1.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 4.2×2.4
- Boards
- —
SILICON LABS DFN-6 3x3MM
celestial-altium-Leadless_DFN
Temperature Sensor Digital - Local -40°C ~ 125°C, 6 Leads, Body 3x3mm, Package 6-VFDFN Exposed Pad
- Pads
- 7
- SMD
- 4.2×3.4
- Boards
- —
SKYWORKS TDFN-14 3x3MM
celestial-altium-Leadless_DFN
TDFN, 14-Leads, Body 3.00x3.00mm, Pitch 0.40mm, Thermal Pad 1.65x2.50mm, IPC Medium Density
- Pads
- 15
- SMD
- 4.2×4.2
- Boards
- —
