Footprints
41 footprints matching “ti”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TI LQFN-40 RVF0040A
celestial-altium-Leadless_QFN
QFN, 40-Leads, Body 5.00x7.00mm, Pitch 0.50mm, Thermal Pad 3.30x5.30mm, IPC Medium Density
- Pads
- 41
- SMD
- 5.8×7.8
- Boards
- —
TI PVQFN-16 4x4mm RSA
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
TI PVQFN-32 5X5MM RHB
celestial-altium-Leadless_QFN
PVQFN, 32-Leads, Body 5.1x5.1mm (max), Pitch 0.50mm, IPC Medium Density
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- —
TI PWQFN-16 3x3MM RTE
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC Medium Density
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
TI QFN-14 RGY0014A
celestial-altium-Leadless_QFN
QFN, 14-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.00x2.00mm, IPC Medium Density
- Pads
- 15
- SMD
- 4.8×4.8
- Boards
- —
TI QFN-16 3x3mm RTE
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x1.70mm, IPC Medium Density
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
TI QFN-16 RGT
celestial-altium-Leadless_QFN
TI BQ24074RGTR
- Pads
- 17
- SMD
- 3.8×3.8
- Boards
- —
TI QFN-32 RSN S-PWQFN-N32
celestial-altium-Leadless_QFN
QFN, 32-Leads, Body 4.00x4.00mm, Pitch 0.40mm, Thermal Pad 2.80x2.80mm
- Pads
- 33
- SMD
- 5.2×5.2
- Boards
- —
TI VQFN-16 4x4mm RGV
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
TI VQFN-16 4x4mm RSA
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 4.1x4.1mm (max), Pitch 0.65mm, IPC Medium Density
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- —
TI VQFN-16 RGT
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 3.1x3.1mm (max), Pitch 0.5mm, IPC Medium Density
- Pads
- 17
- SMD
- 3.8×3.8
- Boards
- —
TI VQFN-16 RVA
celestial-altium-Leadless_QFN
QFN, 16-Leads, Body 3.50x3.50mm, Pitch 0.50mm, Thermal Pad 2.14x2.14mm, IPC Medium Density
- Pads
- 17
- SMD
- 4.7×4.7
- Boards
- —
TI VQFN-18 RNN0018A
celestial-altium-Leadless_QFN
VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm
- Pads
- 18
- SMD
- 4.3×4.3
- Boards
- —
TI VQFN-18 RNV0018B
celestial-altium-Leadless_QFN
VQFN, 18-Leads, Body 3.5x3.5mm, Pitch 0.55mm
- Pads
- 18
- SMD
- 4.3×4.3
- Boards
- —
TI VQFN-20 RGY0020B
celestial-altium-Leadless_QFN
VQFN-20 RGY, 20-Leads, Body 3.50x4.50mm, Pitch 1.50mm/0.50mm, Thermal Pad 1.70x2.70mm
- Pads
- 21
- SMD
- 4.4×5.4
- Boards
- —
TI VQFN-20 RJE0020B
celestial-altium-Leadless_QFN
QFN, 20-Leads, Body 3.00x3.00mm, Pitch 0.45mm, Thermal Pad 0.93x0.98mm, IPC Medium Density
- Pads
- 21
- SMD
- 3.8×3.8
- Boards
- —
TI VQFN-24 RGE
celestial-altium-Leadless_QFN
QFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.45x2.45mm, IPC Medium Density
- Pads
- 25
- SMD
- 4.8×4.8
- Boards
- —
TI VQFN-24 RGE0024B
celestial-altium-Leadless_QFN
VQFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.70x2.70mm
- Pads
- 25
- SMD
- 5.0×5.0
- Boards
- —
TI VQFN-24 RGE0024H
celestial-altium-Leadless_QFN
VQFN, 24-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.70x2.70mm
- Pads
- 25
- SMD
- 5.0×5.0
- Boards
- —
TI VQFN-24 RGY0024F
celestial-altium-Leadless_QFN
VQFN, 24-Leads, Body 3.50x5.50mm, Pitch 1.50mm/0.50mm, Thermal Pad 2.10x4.10mm
- Pads
- 25
- SMD
- 4.4×6.4
- Boards
- —
TI VQFN-24 RHF0024A
celestial-altium-Leadless_QFN
QFN, 24-Leads, Body 5.00x4.00mm, Pitch 0.50mm, Thermal Pad 3.65x2.65mm, IPC Medium Density
- Pads
- 25
- SMD
- 6.3×5.3
- Boards
- —
TI VQFN-28 RVE0028A
celestial-altium-Leadless_QFN
QFN, 28-Leads, Body 3.50x4.50mm, Pitch 0.40mm, Thermal Pad 2.10x3.10mm, IPC Medium Density
- Pads
- 29
- SMD
- 4.7×5.7
- Boards
- —
TI VQFN-32 RHB0032E
celestial-altium-Leadless_QFN
VQFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.45x3.45mm
- Pads
- 33
- SMD
- 6.0×6.0
- Boards
- —
TI VQFN-48 RGZ0048B
celestial-altium-Leadless_QFN
VQFN, 48-Leads, Body 7.00x7.00mm, Pitch 0.50mm, Thermal Pad 4.10x4.10mm
- Pads
- 49
- SMD
- 8.0×8.0
- Boards
- —
