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Footprints

15 footprints matching “WSON”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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SymbolFootprint3D model

Footprints on their own, whether or not a symbol uses them.

15 footprints

Matched by name and keywords. Search by meaning instead

MICROCHIP WSON-8 6x5mm

FP—

celestial-altium-Leadless_SON

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Pads
9
SMD
7.2×5.6
Boards
—

SPANSION WSON-8 6x5MM

FP—

celestial-altium-Leadless_SON

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.00x3.40mm, IPC Medium Density

Pads
9
SMD
7.2×5.6
Boards
—

SPANSION WSON-8 6x8MM

FP—

celestial-altium-Leadless_SON

SON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.80x5.80mm, IPC Medium Density

Pads
9
SMD
9.2×6.6
Boards
—

TI PWSON-10 DPR

FP—

celestial-altium-Leadless_SON

SON, 10-Leads, Body 4.0x4.00mm, Pitch 0.80mm, Thermal Pad 3.00x2.6mm, IPC Medium Density

Pads
11
SMD
5.2×4.4
Boards
—

TI PWSON-10 DSQ

FP—

celestial-altium-Leadless_SON

DFN, 10-Leads, Body 2.00x2.00mm, Pitch 0.40mm, Thermal Pad 0.70x1.20mm, IPC Medium Density

Pads
11
SMD
3.2×3.2
Boards
—

TI WSON-10 DQC

FP—

celestial-altium-Leadless_SON

WSON, 10-Leads, Body 2.00x3.00mm, Pitch 0.50mm, Thermal Pad 0.84x2.40mm, IPC Medium Density

Pads
11
SMD
3.2×4.2
Boards
—

TI WSON-10 DSC

FP—

celestial-altium-Leadless_SON

SON, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.40mm, IPC Medium Density

Pads
11
SMD
3.8×3.8
Boards
—

TI WSON-10 SD

FP—

celestial-altium-Leadless_SON

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.20x2.00mm, IPC Medium Density

Pads
11
SMD
4.2×4.2
Boards
—

TI WSON-12 DNT

FP—

celestial-altium-Leadless_SON

WSON, 12-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.60x3.00mm, IPC Medium Density

Pads
13
SMD
5.2×5.2
Boards
—

TI WSON-12 DRR0012G

FP—

celestial-altium-Leadless_SON

WSON, 12-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.30x2.50mm

Pads
13
SMD
4.0×3.6
Boards
—

TI WSON-16 NHR

FP—

celestial-altium-Leadless_SON

WSON, 16-Leads, Body 5.00x4.00mm, Pitch 0.50mm, Thermal Pad 4.00x2.60mm, IPC Medium Density

Pads
17
SMD
6.2×5.2
Boards
—

TI WSON-6 DRV0006D 2x2MM

FP—

celestial-altium-Leadless_SON

SON, 6-Leads, Body 2.00x2.00mm, Pitch 0.65mm, Thermal Pad 1.60x0.89mm, IPC Medium Density

Pads
7
SMD
2.8×2.6
Boards
—

TI WSON-8 DSG0008A

FP—

celestial-altium-Leadless_SON

WSON, 8-Leads, Body 2.00x2.00mm, Pitch 0.50mm

Pads
9
SMD
3.0×2.6
Boards
—

WINBOND WSON-8 6x5mm

FP—

celestial-altium-Leadless_SON

SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Pads
9
SMD
7.2×5.6
Boards
—

WINBOND WSON-8 8x6MM E

FP—

celestial-altium-Leadless_SON

WSON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density

Pads
9
SMD
9.2×6.6
Boards
—