Footprints
9 footprints
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
BMP
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surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows
- Pads
- 10
- SMD
- 8.6×7.4
- Boards
- —
FPC_1x22_P0.5mm
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Molex FFC/FPC connector, 50 bottom-side contacts, 0.5mm pitch
- Pads
- 22
- SMD
- 11.5×3.6
- Boards
- —
FPC_1x30_P0.5mm
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Molex FFC/FPC connector, 30 bottom-side contacts, 0.5mm pitch
- Pads
- 30
- SMD
- 15.5×3.6
- Boards
- —
L_Vishay_IHLP-5050CE
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Inductor, Vishay, IHLP series, 12.9mmx13.2mm
- Pads
- 2
- SMD
- 15.2×13.6
- Boards
- —
NLC453232T
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- Pads
- 2
- SMD
- 6.2×3.0
- Boards
- —
SMD-DIP-8_W9.53mm
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8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils)
- Pads
- 8
- SMD
- 12.1×10.7
- Boards
- —
Texas_DPY0002A_0.6x1mm_P0.65mm
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X1SON 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf
- Pads
- 2
- SMD
- 1.3×0.9
- Boards
- —
UDFN-6-1EP_2x2mm_P0.65mm_EP0.9x1.65mm
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UDFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/6L_UDFN_2x2x0_6mm_HTA_C04-01156a.pdf)
- Pads
- 7
- SMD
- 3.0×2.5
- Boards
- —
VSONHR-6-1EP-1.5x1.5_P0.5
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- Pads
- 6
- SMD
- 2.0×2.0
- Boards
- —