48 matching

Device

4 resistor network, parallel topology, SIP package, split

Pins

8

Pads

8

THT

21.0×3.1

Sensor_Current

Programmable Linear Hall Effect Sensor, +2.5mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Device

4 resistor network, parallel topology, SIP package

Pins

8

Pads

8

THT

21.0×3.1

Device

4 resistor network, star topology, bussed resistors, split

Pins

5

Pads

5

THT

13.4×3.1

kiml-00-kiml-connector

2.54mm 3A bronze -40℃~+105℃ Straight 1x4P Top 4 Square Holes Plugin,P=2.54mm Female Headers

Pins

4

Pads

4

THT

3.5×11.2

Sensor_Current

Programmable Linear Hall Effect Sensor, +1.3 to +2.9mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Sensor_Current

Programmable Linear Hall Effect Sensor, +1.3 to +2.9mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Sensor_Current

Programmable Linear Hall Effect Sensor, +1.3 to +2.9mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Device

4 resistor network, star topology, bussed resistors, small US symbol

Pins

5

Pads

5

THT

13.4×3.1

gekkio-Gekkio_Memory_Flash

4 Mbit (512k x 8) 4.5-5.5V Multi-Purpose Flash, 70 ns, PDIP-32

Pins

32

Pads

32

THT

17.3×41.2

Memory_RAM

256Kbit Dual-Port Dynamic NMOS RAM (64K x 4-bit), 120/150ns access time (RAM Port), 40/60ns access time (Serial Port), 5V ±10% supply, DIP-24 (400 mil)

Pins

24

Pads

24

THT

12.3×31.0

Relay_SolidState

Solid State Relay (Photo MOSFET) 60V, 0.5A, 2.5Ohm, DIP-4

Pins

4

Pads

4

THT

9.7×5.6

Sensor_Current

Programmable Linear Hall Effect Sensor, +2.9 to +6.4mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Transformer

TEZ4.0/D/x, 4VA, Single Secondary, Cast Resin Transformer, PCB

Pins

4

Pads

9

THT

42.5×35.5

Sensor_Current

Programmable Linear Hall Effect Sensor, +2.9 to +6.4mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Device

4 resistor network, star topology, bussed resistors, small symbol

Pins

5

Pads

5

THT

13.4×3.1

Relay

FINDER 44.62, Dual Pole Relay, 5mm Pitch, 10A

Pins

8

Pads

8

THT

29.5×12.9

Sensor_Current

Programmable Linear Hall Effect Sensor, +2.9 to +6.4mV/G, SIP-4

Pins

4

Pads

4

THT

5.7×2.1

Transformer

TEZ4.0/D/x-x, 4VA, Dual Secondary, Cast Resin Transformer, PCB

Pins

6

Pads

9

THT

42.5×35.5

Device

13 resistor network, star topology, bussed resistors, split

Pins

14

Pads

14

THT

36.2×3.1

Connector_Audio

speakON Chassis Connectors, 4 pole chassis connector, black D-size flange, mirrored self tapping screw holes (A-screw), horizontal PCB mount. Replaces NL4MD-H-2

Pins

4

Pads

4

THT

34.2×27.0

Relay

FINDER 44.52, Dual Pole Relay, 5mm Pitch, 6A

Pins

8

Pads

8

THT

29.5×12.9

Connector_Audio

speakON Chassis Connectors, 4 pole chassis connector, black D-size flange, mirrored self tapping screw holes (A-screw), vertical PCB mount. Replaces NL4MD-V-2

Pins

4

Pads

4

THT

27.0×32.0

Device

12 resistor network, star topology, bussed resistors, split

Pins

13

Pads

13

THT

33.7×3.1

Interface

Parallel I/O, DIP-40

Pins

40

Pads

40

THT

17.3×51.3

MCU_Microchip_ATmega

20MHz, 64kB Flash, 4kB SRAM, 2kB EEPROM, JTAG, DIP-40

Pins

40

Pads

40

THT

17.3×51.3

Transistor_FET

22A Id, 1000V Vds, 120mOhm, N-Channel SiC MOSFET, TO-247-4

Pins

4

Pads

4

THT

16.4×5.5

Device

4 voltage divider network, dual terminator, SIP package

Pins

6

Pads

6

THT

15.9×3.1

Transistor_FET

63A Id, 900V Vds, 30mOhm, N-Channel SiC MOSFET, TO-247-4

Pins

4

Pads

4

THT

16.4×5.5

Diode_Bridge

Single-Phase Bridge Rectifier, 420V Vrms, 4.0A If, KBU package

Pins

4

Pads

4

THT

23.7×7.7

Transistor_FET

30A Id, 1200V Vds, 75mOhm, N-Channel SiC MOSFET, TO-247-4

Pins

4

Pads

4

THT

16.4×5.5

Transistor_FET

35A Id, 1000V Vds, 65mOhm, N-Channel SiC MOSFET, TO-247-4

Pins

4

Pads

4

THT

16.4×5.5

Device

2 resistor network, parallel topology, SIP package

Pins

4

Pads

4

THT

10.8×3.1

Relay

Monostable relay DPDT, 29x12.7mm body size, 5mm pitch, 8A, EN50005

Pins

8

Pads

8

THT

29.6×13.2

Analog_DAC

Double-Buffered D to A Converters, DIP-20

Pins

20

Pads

20

THT

9.7×25.9

Interface

Parallel I/O, CMOS, DIP-40

Pins

40

Pads

40

THT

17.3×51.3

Device

11 resistor network, star topology, bussed resistors, split

Pins

12

Pads

12

THT

31.1×3.1

Device

2 resistor network, parallel topology, SIP package, split

Pins

4

Pads

4

THT

10.8×3.1

Isolator

DC Optocoupler, Vce 35V, DIP-4

Pins

4

Pads

4

THT

9.7×5.6

Memory_EEPROM

Field Memory, 262264 x 4 bit, [Obsolete 1992-01]

Pins

16

Pads

16

THT

9.7×20.8

Device

10 resistor network, star topology, bussed resistors, split

Pins

11

Pads

11

THT

28.6×3.1

Interface

Direct Memory Access Controller 2MHz, DIP-40

Pins

40

Pads

40

THT

17.3×51.3

Interface

CHMOS Programmable Peripheral Interface, PDIP-40

Pins

40

Pads

40

THT

17.3×51.3

Device

9 resistor network, star topology, bussed resistors, split

Pins

10

Pads

10

THT

26.1×3.1

Diode_Bridge

Single-Phase Bridge Rectifier, 140V Vrms, 4.0A If, KBU package

Pins

4

Pads

4

THT

23.7×7.7

Power_Supervisor

Microprocessor Supervisory Circuit, Battery-Backup Power Switching, Power-Fail Comparator, VCC 4.75...5.5V, VBATT 2.0...4.25V, Reset Voltage Threshold 4.65V, Reset Timeout Delay 200ms, Watchdog Timeout 1.6s, DIP-8

Pins

8

Pads

8

THT

9.7×10.7

MCU_Microchip_8051

8-bit Microcontroller with 4K Bytes Flash, DIP-40

Pins

40

Pads

40

THT

17.3×51.3

MCU_Microchip_ATmega

20MHz, 64kB Flash, 4kB SRAM, 2kB EEPROM, JTAG, DIP-40

Pins

40

Pads

40

THT

17.3×51.3