Components

48 matching

Each one is a symbol, its recommended footprint and its 3D package model, linked by KiCad's own references and cross-checked pin by pin.

Exact SemanticRanked by meaning — describe the part you need

48 components

MCP2562-E-P

SYMFP3D

Interface_CAN_LIN

High-Speed CAN Transceiver, 1Mbps, 5V supply, Vio pin, -40C to +125C, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Network13_Split

SYMFP3D

Device

13 resistor network, star topology, bussed resistors, split

Pins: 14
Pads: 14
THT: 36.2×3.1

MCP2562-H-P

SYMFP3D

Interface_CAN_LIN

High-Speed CAN Transceiver, 1Mbps, 5V supply, Vio pin, -40C to +150C, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Network12_Split

SYMFP3D

Device

12 resistor network, star topology, bussed resistors, split

Pins: 13
Pads: 13
THT: 33.7×3.1

MCP2561-E-P

SYMFP3D

Interface_CAN_LIN

High-Speed CAN Transceiver, 1Mbps, 5V supply, SPLIT pin, -40C to +125C, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

MCP2561-H-P

SYMFP3D

Interface_CAN_LIN

High-Speed CAN Transceiver, 1Mbps, 5V supply, SPLIT pin, -40C to +150C, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Network11_Split

SYMFP3D

Device

11 resistor network, star topology, bussed resistors, split

Pins: 12
Pads: 12
THT: 31.1×3.1

MCP2551-I-P

SYMFP3D

Interface_CAN_LIN

High-Speed CAN Transceiver, 1Mbps, 5V supply, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Network10_Split

SYMFP3D

Device

10 resistor network, star topology, bussed resistors, split

Pins: 11
Pads: 11
THT: 28.6×3.1

PIC18F458-IP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 1536B SRAM, 256 EEPROM, CAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

R_Network09_Split

SYMFP3D

Device

9 resistor network, star topology, bussed resistors, split

Pins: 10
Pads: 10
THT: 26.1×3.1

PIC18F448-IP

SYMFP3D

MCU_Microchip_PIC18

16K Flash, 768B SRAM, 256 EEPROM, CAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

R_Network08_Split

SYMFP3D

Device

8 resistor network, star topology, bussed resistors, split

Pins: 9
Pads: 9
THT: 23.5×3.1

R_Network07_Split

SYMFP3D

Device

7 resistor network, star topology, bussed resistors, split

Pins: 8
Pads: 8
THT: 21.0×3.1

PIC18LF458-IP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 1536B SRAM, 256 EEPROM, CAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

MCP2050-500-EP

SYMFP3D

Interface_CAN_LIN

LIN Transceiver with Voltage Regulator, 5V, PDIP

Pins: 14
Pads: 14
THT: 9.7×18.3

R_Network06_Split

SYMFP3D

Device

6 resistor network, star topology, bussed resistors, split

Pins: 7
Pads: 7
THT: 18.4×3.1

PIC18LF448-IP

SYMFP3D

MCU_Microchip_PIC18

16K Flash, 768B SRAM, 256 EEPROM, CAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

MCP2050-330-EP

SYMFP3D

Interface_CAN_LIN

LIN Transceiver with Voltage Regulator, 3.3V, PDIP

Pins: 14
Pads: 14
THT: 9.7×18.3

SN75160BN

SYMFP3D

Interface

Octal general-purpose interface bus transceiver, DIP-20

Pins: 20
Pads: 20
THT: 9.7×25.9

MCP2022A-xxxxP

SYMFP3D

Interface_CAN_LIN

LIN Transceiver with Voltage Regulator, 3.3V/5V, DIP-14

Pins: 14
Pads: 14
THT: 9.7×18.3

MSP430G2253IN20

SYMFP3D

MCU_Texas_MSP430

2kB Flash, 256B RAM, DIP-20

Pins: 20
Pads: 20
THT: 9.7×25.9

PIC18F25K83-xSP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 2K RAM, 1K EEPROM, 2.3-5.5V, PIC18, low-power microcontroller with CAN, DIP-28

Pins: 28
Pads: 28
THT: 9.7×36.1

R_Network05_Split

SYMFP3D

Device

5 resistor network, star topology, bussed resistors, split

Pins: 6
Pads: 6
THT: 15.9×3.1

R_Network04_Split

SYMFP3D

Device

4 resistor network, star topology, bussed resistors, split

Pins: 5
Pads: 5
THT: 13.4×3.1

EL7222CN

SYMFP3D

Driver_FET

High Speed, Dual Channel Power MOSFET Driver, 4.5..15V supply, I(PK)=2A, complementary drivers, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

EL7212CN

SYMFP3D

Driver_FET

High Speed, Dual Channel Power MOSFET Driver, 4.5..15V supply, I(PK)=2A, inverting drivers, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

G6HU-2

SYMFP3D

Relay

Omron Ultracompact, Ultrasensitive DPDT Relay, Single-winding Latching

Pins: 10
Pads: 10
THT: 10.7×15.3

R_Pack07_SIP

SYMFP3D

Device

7 resistor network, parallel topology, SIP package

Pins: 14
Pads: 14
THT: 36.2×3.1

MSP430G2213IN20

SYMFP3D

MCU_Texas_MSP430

2kB Flash, 256B RAM, DIP-20

Pins: 20
Pads: 20
THT: 9.7×25.9

PIC18F26K83-xSP

SYMFP3D

MCU_Microchip_PIC18

64K Flash, 4K RAM, 1K EEPROM, 2.3-5.5V, PIC18, low-power microcontroller with CAN, DIP-28

Pins: 28
Pads: 28
THT: 9.7×36.1

EL7202CN

SYMFP3D

Driver_FET

High Speed, Dual Channel Power MOSFET Driver, 4.5..15V supply, I(PK)=2A, non-inverting drivers, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Pack06_SIP

SYMFP3D

Device

6 resistor network, parallel topology, SIP package

Pins: 12
Pads: 12
THT: 31.1×3.1

R_Pack07_SIP_Split

SYMFP3D

Device

7 resistor network, parallel topology, SIP package, split

Pins: 14
Pads: 14
THT: 36.2×3.1

PIC18F4480-IP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 768B SRAM, 256 EEPROM, ECAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

PIC18F4580-IP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 1536B SRAM, 256 EEPROM, ECAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

G5V-2

SYMFP3D

Relay

Relay Miniature Omron DPDT

Pins: 8
Pads: 8
THT: 10.6×20.8

R_Pack06_SIP_Split

SYMFP3D

Device

6 resistor network, parallel topology, SIP package, split

Pins: 12
Pads: 12
THT: 31.1×3.1

EL2001CN

SYMFP3D

Amplifier_Buffer

Monolithic high slew rate, buffer amplifier, DIP-8

Pins: 8
Pads: 8
THT: 9.7×10.7

R_Pack05_SIP

SYMFP3D

Device

5 resistor network, parallel topology, SIP package

Pins: 10
Pads: 10
THT: 26.1×3.1

TEZ2.0-D-2

SYMFP3D

Transformer

TEZ2.0/D/x-x, 2VA, Dual Secondary, Cast Resin Transformer, PCB

Pins: 6
Pads: 9
THT: 31.5×28.5

G5V-2_Split

SYMFP3D

Relay

Relay Miniature Omron DPDT

Pins: 8
Pads: 8
THT: 10.6×20.8

MSP430G2453IN20

SYMFP3D

MCU_Texas_MSP430

8kB Flash, 512B RAM, DIP-20

Pins: 20
Pads: 20
THT: 9.7×25.9

Conn-02x10_P2.54mm_B-2100S20P-B110

SYMFP3D

kiml-00-kiml-connector

Straight 2.54mm 6mm -40℃~+105℃ 2 3mm 20 2.54mm Black Brass 2x10P 2.54mm Straight,P=2.54mm Pin Headers ROHS

Pins: 20
Pads: 20
THT: 6.1×26.4

R_Network03_Split

SYMFP3D

Device

3 resistor network, star topology, bussed resistors, split

Pins: 4
Pads: 4
THT: 10.8×3.1

PIC18LF4480-IP

SYMFP3D

MCU_Microchip_PIC18

32K Flash, 768B SRAM, 256 EEPROM, ECAN, DIP40

Pins: 40
Pads: 40
THT: 17.3×51.3

R_Pack05_SIP_Split

SYMFP3D

Device

5 resistor network, parallel topology, SIP package, split

Pins: 10
Pads: 10
THT: 26.1×3.1

MSP430G2153IN20

SYMFP3D

MCU_Texas_MSP430

1kB Flash, 256B RAM, DIP-20

Pins: 20
Pads: 20
THT: 9.7×25.9