Components
48 matching
Each one is a symbol, its recommended footprint and its 3D package model, linked by KiCad's own references and cross-checked pin by pin.
74HC7014
74xx
Hex non-inverting buffer with precision Schmitt Trigger inputs, SOIC-14
- Pins
- 14
- Pads
- 14
- SMD
- 7.4×9.2
8086_Max_Mode
MCU_Intel
8086 (maximum mode), 16-Bit HMOS Microprocessor, PDIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
HM62256BLP
Memory_RAM
32,768-word × 8-bit High Speed CMOS Static RAM, 70ns, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 17.3×36.1
Si8660ED-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
8086_Min_Mode
MCU_Intel
8086 (minimum mode), 16-Bit HMOS Microprocessor, PDIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
Si8660BD-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
Si8663ED-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
MC68B00
CPU_NXP_6800
8-Bit Microprocessing unit 2.0MHz, DIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
IDT7206
Memory_RAM
16384x9 CMOS Asynchronous FIFO, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 9.7×36.1
Si8661ED-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
Si8660ED-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
HM50256P
Memory_RAM
262144 x 1 bit Dynamic RAM, 120/150/200ns access time, single 5V ±10% power supply, TTL compatible inputs, DIP-16 (DP-16A package)
- Pins
- 16
- Pads
- 16
- THT
- 9.7×20.8
Si8662ED-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
8088_Max_Mode
MCU_Intel
8088 (maximum mode), 8-Bit HMOS Microprocessor, PDIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
DL1416
Display_Character
.160", 4-Digit 16-Segment plus decimal alphanumeric intelligent display with Memory/Decoder/Driver
- Pins
- 20
- Pads
- 20
- THT
- 31.8×25.9
Si8662BD-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
H5AN8G8NAFR-UHC
Memory_RAM
8Gb CMOS Double Data Rate IV Synchronous RAM
- Pins
- 78
- Pads
- 78
- SMD
- 9.5×13.0
Si8660EB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe High, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
Si8660BD-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
MC68A00
CPU_NXP_6800
8-Bit Microprocessing unit 1.5MHz, DIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
Si8661BD-B-IS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
IDT7208
Memory_RAM
65536x9 CMOS Asynchronous FIFO, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 9.7×36.1
AS6C4008-55PCN
Memory_RAM
512K x 8 Low Power CMOS RAM, DIP-32
- Pins
- 32
- Pads
- 32
- THT
- 17.3×41.2
Si8662ED-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
Si8663ED-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
MC68B02
CPU_NXP_6800
8-Bit Microprocessing unit 2.0MHz, DIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
IDT7204
Memory_RAM
4096x9 CMOS Asynchronous FIFO, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 9.7×36.1
Si8661ED-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe High, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
Si8660BB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe Low, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
HY6264AxP
Memory_RAM
Not in Production, 8Kx8 bit Static RAM, 70/85/100/120/150ns, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 17.3×36.1
HIP4082xP
Driver_FET
80V, 1.25A Peak Current H-Bridge FET Driver, DIP-16
- Pins
- 16
- Pads
- 16
- THT
- 9.7×20.8
Si8661BD-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
Si8661EB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe High, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
82C55A
Interface
CHMOS Programmable Peripheral Interface, PDIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
HD3SS6126
Interface_USB
USB 3.0 + USB 2.0 Differential Switch 2:1/1:2 MUX/DEMUX, WQFN-42
- Pins
- 43
- Pads
- 43
- SMD
- 4.8×10.3
Si8660EB-AU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe High, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
Si8662EB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe High, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
8088
MCU_Intel
8088 (minimum mode), 8-Bit HMOS Microprocessor, PDIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
MC6800
CPU_NXP_6800
8-Bit Microprocessing unit 1.0MHz, DIP-40
- Pins
- 40
- Pads
- 40
- THT
- 17.3×51.3
Si8663EB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe High, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
Si8662BD-AS
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 5kV isolation, Fail-Safe Low, SOIC-16W
- Pins
- 16
- Pads
- 16
- SMD
- 11.9×10.8
IDT7205
Memory_RAM
8192x9 CMOS Asynchronous FIFO, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 9.7×36.1
Si8662BB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe Low, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
IDT7207
Memory_RAM
32768x9 CMOS Asynchronous FIFO, DIP-28
- Pins
- 28
- Pads
- 28
- THT
- 9.7×36.1
SN75160BN
Interface
Octal general-purpose interface bus transceiver, DIP-20
- Pins
- 20
- Pads
- 20
- THT
- 9.7×25.9
Si8660BB-AU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe Low, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
Si8663BB-B-IU
Isolator
Low-Power Hex-Channel Digital Isolator, 150Mbps, 2.5-5.5V, 2.5kV isolation, Fail-Safe Low, QSOP-16
- Pins
- 16
- Pads
- 16
- SMD
- 7.4×5.4
27C256
Memory_EPROM
OTP EPROM 256 KiBit
- Pins
- 28
- Pads
- 28
- THT
- 17.3×36.1
