Footprints

72 footprints matching “48”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

72 footprints · page 1 of 3

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LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

USB_Mini-B_Lumberg_2486_01_Horizontal

FP3D

Connector_USB

USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf

Pads: 6
SMD: 11.9×10.6
Boards: 96

TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85

TSSOP-48_6.1x12.5mm_P0.5mm

FP3D

Package_SO

TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 48
SMD: 9.4×13.0
Boards: 36

TSOP-I-48_18.4x12mm_P0.5mm

FP3D

Package_SO

TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD)

Pads: 48
SMD: 21.5×12.5
Boards: 35

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 19

UQFN-10_1.4x1.8mm_P0.4mm

FP3D

Package_DFN_QFN

UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)

Pads: 10
SMD: 2.6×3.0
Boards: 15

LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm

FP3D

Package_QFP

LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: 15

UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm

FP3D

Package_DFN_QFN

UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf

Pads: 5
SMD: 1.8×1.5
Boards: 12

DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm

FP3D

Package_DFN_QFN

10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)

Pads: 11
SMD: 4.3×3.7
Boards: 11

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 11

QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 9

TQFP-48-1EP_7x7mm_P0.5mm_EP5x5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45))

Pads: 49
SMD: 10.3×10.3
Boards: 8

SSOP-48_7.5x15.9mm_P0.635mm

FP3D

Package_SO

SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf)

Pads: 48
SMD: 11.1×16.5
Boards: 8

LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm_ThermalVias

FP3D

Package_QFP

LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: 6

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads: 49
SMD: 8.3×8.3
Boards: 5

TQFN-48-1EP_7x7mm_P0.5mm_EP5.1x5.1mm

FP3D

Package_DFN_QFN

TQFN, 48 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0144.pdf)

Pads: 49
SMD: 8.3×8.3
Boards: 3

SMDIP-8_W11.48mm

FP3D

Package_DIP

8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads: 8
SMD: 14.0×10.7
Boards: 2

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: 2