Footprints
8 footprints matching “85mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-8_7.5x5.85mm_P1.27mm
Package_SO
SOIC, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf)
- Pads
- 8
- SMD
- 13.0×6.4
- Boards
- 17
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 5
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- 3
UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)
- Pads
- 21
- SMD
- 4.2×4.2
- Boards
- 1
L_TDK_MLZ2012_h0.85mm
Inductor_SMD
Inductor, TDK, MLZ2012_h0.85mm, 2.0x1.25x0.85mm, ( "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf")
- Pads
- 2
- SMD
- 3.1×1.8
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
HXQFN-16-1EP_3x3mm_P0.5mm_EP1.85x1.85mm_ThermalVias
Package_DFN_QFN
HXQFN, 16 Pin (https://www.nxp.com/docs/en/data-sheet/NX3L4051.pdf#page=17)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —
