Footprints
190 footprints matching “8mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-32_7x7mm_P0.8mm
Package_QFP
TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)
- Pads
- 32
- SMD
- 10.3×10.3
- Boards
- 503
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
SOIC-20W_7.5x12.8mm_P1.27mm
Package_SO
SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)
- Pads
- 20
- SMD
- 11.9×13.3
- Boards
- 279
TSSOP-24_4.4x7.8mm_P0.65mm
Package_SO
TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 24
- SMD
- 7.7×8.3
- Boards
- 242
LQFP-32_7x7mm_P0.8mm
Package_QFP
LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf)
- Pads
- 32
- SMD
- 10.4×10.4
- Boards
- 185
SSOP-8_2.95x2.8mm_P0.65mm
Package_SO
SSOP-8 2.9 x2.8mm Pitch 0.65mm
- Pads
- 8
- SMD
- 5.5×3.3
- Boards
- 57
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
TSOP-II-54_22.2x10.16mm_P0.8mm
Package_SO
54-lead TSOP typ II package
- Pads
- 54
- SMD
- 13.5×22.7
- Boards
- 55
LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y
Package_LGA
LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf)
- Pads
- 14
- SMD
- 3.5×5.5
- Boards
- 50
TSOP-II-44_10.16x18.41mm_P0.8mm
Package_SO
TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 44
- SMD
- 13.2×18.9
- Boards
- 47
Texas_DRT-3
Package_TO_SOT_SMD
Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf
- Pads
- 3
- SMD
- 1.6×1.4
- Boards
- 39
Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering
Package_LGA
Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44)
- Pads
- 8
- SMD
- 3.5×3.5
- Boards
- 38
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 28
LQFP-44_10x10mm_P0.8mm
Package_QFP
LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 27
BGA-256_14.0x14.0mm_Layout16x16_P0.8mm_Ball0.45mm_Pad0.32mm_NSMD
Package_BGA
BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 256
- SMD
- 16.0×16.0
- Boards
- 23
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
SMDIP-4_W9.53mm_Clearance8mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 4
- SMD
- 11.5×5.6
- Boards
- 18
TQFP-64_14x14mm_P0.8mm
Package_QFP
TQFP, 64 Pin (JEDEC MS-026 variation AEB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=672)
- Pads
- 64
- SMD
- 17.3×17.3
- Boards
- 18
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
LED_RGB_Wuerth-PLCC4_3.2x2.8mm_150141M173100
LED_SMD
3.2mm x 2.8mm PLCC4 LED, https://www.we-online.de/katalog/datasheet/150141M173100.pdf
- Pads
- 4
- SMD
- 5.1×3.3
- Boards
- 16
BGA-96_9.0x13.0mm_Layout2x3x16_P0.8mm
Package_BGA
BGA-96, http://www.mouser.com/ds/2/198/43-46TR16640B-81280BL-706483.pdf
- Pads
- 96
- SMD
- 11.0×15.0
- Boards
- 15
UQFN-10_1.4x1.8mm_P0.4mm
Package_DFN_QFN
UQFN, 10 Pin (https://www.onsemi.com/pub/Collateral/488AT.PDF)
- Pads
- 10
- SMD
- 2.6×3.0
- Boards
- 15
SW_DIP_SPSTx03_Slide_6.7x9.18mm_W8.61mm_P2.54mm_LowProfile
Button_Switch_SMD
SMD 3x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see e.g. https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile
- Pads
- 6
- SMD
- 11.6×9.8
- Boards
- 14
QFN-28-1EP_6x6mm_P0.65mm_EP4.8x4.8mm
Package_DFN_QFN
QFN, 28 Pin (https://semtech.my.salesforce.com/sfc/p/#E0000000JelG/a/440000001NCE/v_VBhk1IolDgxwwnOpcS_vTFxPfSEPQbuneK3mWsXlU page=125)
- Pads
- 29
- SMD
- 7.3×7.3
- Boards
- 14