Footprints
10 footprints matching “Pack”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
LQFP-144_20x20mm_P0.5mm
Package_QFP
LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)
- Pads
- 144
- SMD
- 23.3×23.3
- Boards
- 104
LQFP-128_14x14mm_P0.4mm
Package_QFP
LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)
- Pads
- 128
- SMD
- 17.3×17.3
- Boards
- 9
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
SOT-963
Package_TO_SOT_SMD
SOT 963 6 pins package 1x0.8mm pitch 0.35mm
- Pads
- 6
- SMD
- 1.6×1.5
- Boards
- 1
Texas_RWU-VQFN-N7_2.1x2.1mm
kiml-00-kiml-dfn-qfn
PLASTIC QUAD FLAT PACK - NO LEAD
- Pads
- 7
- SMD
- 2.6×2.4
- Boards
- —
ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger
Package_CSP
ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101
- Pads
- 19
- SMD
- 3.7×4.5
- Boards
- —
ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger
Package_CSP
ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197
- Pads
- 39
- SMD
- 4.8×4.8
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —