Footprints
6 footprints matching “SIP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Sipeed-M1
FP3D
Module
MAIX Dual Core RISC-V MCU, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications
- Pads
- 72
- SMD
- 27.0×27.0
- Boards
- —
Sipeed-M1W
FP3D
Module
MAIX RISC-V Dual Core MCU with wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications
- Pads
- 72
- SMD
- 27.0×27.0
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias
FP3D
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- 5
OnSemi_SIP-38-6EP-9x7mm_P0.65mm_EP1.2x1.2mm
FP3D
Package_DFN_QFN
On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19)
- Pads
- 44
- SMD
- 9.5×7.5
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm
FP3D
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- —
ST-SiP-LGA-86-11x7.3mm
FP3D
RF_Module
STM32WB5MMG Module, LGA86L 11x7.3
- Pads
- 86
- SMD
- 7.8×11.5
- Boards
- —
