Footprints

2,950 footprints matching “T”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

2,950 footprints · page 1 of 123

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TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 20
SMD: 7.7×7.0
Boards: 731

TO-252-2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 3
SMD: 11.1×7.0
Boards: 658

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 16
SMD: 7.7×5.5
Boards: 579

TSSOP-14_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 14
SMD: 7.7×5.5
Boards: 507

TQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)

Pads: 32
SMD: 10.3×10.3
Boards: 503

TSOT-23-6

FP3D

Package_TO_SOT_SMD

TSOT, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA)

Pads: 6
SMD: 4.1×3.4
Boards: 352

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

TSOT-23-5

FP3D

Package_TO_SOT_SMD

TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)

Pads: 5
SMD: 4.1×3.4
Boards: 256

TSSOP-24_4.4x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 24
SMD: 7.7×8.3
Boards: 242

TO-263-5_TabPin3

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/

Pads: 5
SMD: 16.6×11.3
Boards: 217

TSSOP-8_4.4x3mm_P0.65mm

FP3D

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 8
SMD: 7.7×3.5
Boards: 179

TO-263-2

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/

Pads: 3
SMD: 16.6×11.3
Boards: 168

TSSOP-28_4.4x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 28
SMD: 7.7×10.2
Boards: 164

TO-252-3_TabPin2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 3
SMD: 11.1×7.0
Boards: 161

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads: 10
SMD: 6.3×3.5
Boards: 153

TSOT-23

FP3D

Package_TO_SOT_SMD

3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf

Pads: 3
SMD: 4.3×3.4
Boards: 112

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

TO-263-3_TabPin2

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/

Pads: 3
SMD: 16.6×11.3
Boards: 102

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

TQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=666)

Pads: 48
SMD: 10.3×10.3
Boards: 85

TDSON-8-1

FP3D

Package_TO_SOT_SMD

Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/)

Pads: 5
SMD: 7.2×5.7
Boards: 70

TSOP-6_1.65x3.05mm_P0.95mm

FP3D

Package_SO

TSOP-6 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf

Pads: 6
SMD: 3.5×3.5
Boards: 69

TSOT-23-6_HandSoldering

FP3D

Package_TO_SOT_SMD

6-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf

Pads: 6
SMD: 5.9×3.4
Boards: 64

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 64
SMD: 13.3×13.3
Boards: 58