Footprints
496 footprints matching “TH,”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
ESP32-WROOM-32
RF_Module
Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.0×41.3
- Boards
- 548
TQFP-44_10x10mm_P0.8mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)
- Pads
- 44
- SMD
- 13.3×13.3
- Boards
- 335
ESP32-S3-WROOM-1
RF_Module
2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf
- Pads
- 41
- SMD
- 48.0×41.2
- Boards
- 253
SW_SPST_SKQG_WithStem
Button_Switch_SMD
ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, With stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAFE010.html
- Pads
- 2
- SMD
- 8.5×5.7
- Boards
- 101
ESP32-WROOM-32U
RF_Module
Single 2.4 GHz Wi-Fi and Bluetooth combo chip with U.FL connector, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf
- Pads
- 39
- SMD
- 19.5×20.2
- Boards
- 72
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm_ThermalVias
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 60
SW_SPST_SKQG_WithoutStem
Button_Switch_SMD
ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html
- Pads
- 2
- SMD
- 8.5×5.7
- Boards
- 48
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
ESP32-WROOM-32E
RF_Module
2.4 GHz Wi-Fi and Bluetooth 5 (LE) module: https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf
- Pads
- 39
- SMD
- 48.5×41.5
- Boards
- 41
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm_ThermalVias
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 40
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
ESP32-S3-WROOM-2
RF_Module
2.4 GHz Wi-Fi and Bluetooth 5 (LE) module: https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-2_datasheet_en.pdf
- Pads
- 41
- SMD
- 48.5×41.5
- Boards
- 24
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 21
DIP-6_W8.89mm_SMDSocket_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 6
- SMD
- 12.5×8.2
- Boards
- 21
Texas_S-PVSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 21
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
L_Wuerth_MAPI-3015
Inductor_SMD
Inductor, Wuerth, MAPI-3015, 3.0x3.0x1.5mm, (https://www.we-online.com/en/components/products/WE-MAPI?kicad)
- Pads
- 2
- SMD
- 3.9×3.9
- Boards
- 16
L_Wuerth_MAPI-3020
Inductor_SMD
Inductor, Wuerth, MAPI-3020, 3.0x3.0x2.0mm, (https://www.we-online.com/en/components/products/WE-MAPI?kicad)
- Pads
- 2
- SMD
- 3.9×3.9
- Boards
- 16
LED_RGB_Wuerth-PLCC4_3.2x2.8mm_150141M173100
LED_SMD
3.2mm x 2.8mm PLCC4 LED, https://www.we-online.de/katalog/datasheet/150141M173100.pdf
- Pads
- 4
- SMD
- 5.1×3.3
- Boards
- 16
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm_ThermalVias
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 15
DIP-4_W8.89mm_SMDSocket_LongPads
Package_DIP
4-lead though-hole mounted DIP package, row spacing 8.89mm (350 mils), SMDSocket, LongPads
- Pads
- 4
- SMD
- 12.5×5.7
- Boards
- 15