Footprints
385 footprints matching “0.5A”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
NetTie-2_SMD_Pad0.5mm
NetTie
Net tie, 2 pin, 0.5mm square SMD pads
- Pads
- 2
- SMD
- smd
- Boards
- 309
Fiducial_0.5mm_Mask1mm
Fiducial
Fiducial, circular marking, 0.5mm bare copper, 1mm soldermask opening (Level C)
- Pads
- —
- SMD
- 1.5×1.5
- Boards
- 161
InvenSense_QFN-24_4x4mm_P0.5mm
Sensor_Motion
24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)
- Pads
- 24
- SMD
- 5.3×5.3
- Boards
- 136
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
USON-10_2.5x1.0mm_P0.5mm
Package_SON
USON-10 2.5x1.0mm_ Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf
- Pads
- 10
- SMD
- 1.8×3.0
- Boards
- 84
Fiducial_0.5mm_Mask1.5mm
Fiducial
Fiducial, circular marking, 0.5mm bare copper, 1.5mm soldermask opening
- Pads
- —
- SMD
- 2.0×2.0
- Boards
- 70
LGA-28_5.2x3.8mm_P0.5mm
Package_LGA
LGA 28 5.2x3.8mm Pitch 0.5mm
- Pads
- 28
- SMD
- 6.0×4.5
- Boards
- 56
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
Texas_DRC0010J_ThermalVias
Package_SON
Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf
- Pads
- 11
- SMD
- 3.9×3.9
- Boards
- 45
Hirose_FH12-24S-0.5SH_1x24-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 25
- SMD
- 18.1×7.9
- Boards
- 36
Hirose_FH12-6S-0.5SH_1x06-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 7
- SMD
- 9.1×7.9
- Boards
- 31
Hirose_FH12-40S-0.5SH_1x40-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-40S-0.5SH, 40 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 41
- SMD
- 26.1×7.9
- Boards
- 29
Hirose_FH12-10S-0.5SH_1x10-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-10S-0.5SH, 10 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 11
- SMD
- 11.1×7.9
- Boards
- 25
Hirose_FH12-22S-0.5SH_1x22-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-22S-0.5SH, 22 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 23
- SMD
- 17.1×7.9
- Boards
- 25
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
TE_2-1734839-4_1x24-1MP_P0.5mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 24 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0
- Pads
- 25
- SMD
- 18.4×6.7
- Boards
- 21
Texas_S-PVSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 21
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
SiliconLabs_QFN-20-1EP_3x3mm_P0.5mm_EP1.8x1.8mm
Package_DFN_QFN
20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf
- Pads
- 21
- SMD
- 4.5×4.5
- Boards
- 18
Hirose_FH12-30S-0.5SH_1x30-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-30S-0.5SH, 30 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 31
- SMD
- 21.1×7.9
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
Hirose_FH12-20S-0.5SH_1x20-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-20S-0.5SH, 20 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 21
- SMD
- 16.1×7.9
- Boards
- 15