Footprints

93 footprints matching “10mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

93 footprints · page 1 of 4

Matched by name and keywords. Search by meaning instead

LQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf)

Pads
64
SMD
13.4×13.4
Boards
663

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads
44
SMD
13.3×13.3
Boards
335

TQFP-64_10x10mm_P0.5mm

FP3D

Package_QFP

TQFP, 64 Pin (JEITA/EIAJ ED-7311A (variation 64-001-TCA) / JEDEC MS-026 (variation ACD), 1.00mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=30, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads
64
SMD
13.3×13.3
Boards
58

SolderWirePad_1x01_SMD_5x10mm

FP—

Connector_Wire

Wire Pad, Square, SMD Pad, 5mm x 10mm

Pads
1
SMD
5.3×10.3
Boards
46

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads
44
SMD
13.3×13.3
Boards
27

PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

PQFP, 44 Pin (JEDEC MS-022 variation AB, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-21291a.pdf)

Pads
44
SMD
14.5×14.5
Boards
7

LQFP-64-1EP_10x10mm_P0.5mm_EP5x5mm

FP—

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf)

Pads
65
SMD
13.4×13.4
Boards
5

LQFP-64-1EP_10x10mm_P0.5mm_EP5x5mm_ThermalVias

FP—

Package_QFP

LQFP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf)

Pads
65
SMD
13.4×13.4
Boards
4

UFBGA-201_10x10mm_Layout15x15_P0.65mm

FP—

Package_BGA

UFBGA-201, 10.0x10.0mm, 201 Ball, 15x15 Layout, 0.65mm Pitch, http://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=166

Pads
201
SMD
12.0×12.0
Boards
3

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm_ThermalVias

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads
81
SMD
11.2×11.2
Boards
3

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads
65
SMD
13.3×13.3
Boards
3

LQFP-80_10x10mm_P0.4mm

FP3D

Package_QFP

LQFP, 80 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q80.10x10.pdf)

Pads
80
SMD
13.3×13.3
Boards
3

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads
45
SMD
13.3×13.3
Boards
3

QFN-72-1EP_10x10mm_P0.5mm_EP6x6mm

FP—

Package_DFN_QFN

QFN, 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70)

Pads
73
SMD
11.3×11.3
Boards
2

QFN-80-1EP_10x10mm_P0.4mm_EP3.4x3.4mm

FP—

Package_DFN_QFN

QFN, 80 Pin (https://datasheets.raspberrypi.com/rp2350/rp2350-datasheet.pdf)

Pads
81
SMD
11.2×11.2
Boards
2

Mounting_Wuerth_WA-SMSI-M3_H10mm_9774100360

FP3D

Mounting_Wuerth

Mounting Hardware, inside through hole M3, height 10, Wuerth electronics 9774100360 (https://www.we-online.com/components/products/datasheet/9774100360R.pdf)

Pads
1
SMD
7.9×7.9
Boards
1

LFBGA-100_10x10mm_Layout10x10_P0.8mm

FP3D

Package_BGA

LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87

Pads
100
SMD
12.0×12.0
Boards
1

LFBGA-144_10x10mm_Layout12x12_P0.8mm

FP3D

Package_BGA

LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114

Pads
144
SMD
12.0×12.0
Boards
1

TFBGA-121_10x10mm_Layout11x11_P0.8mm

FP3D

Package_BGA

TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495

Pads
121
SMD
12.0×12.0
Boards
1

UFBGA-144_10x10mm_Layout12x12_P0.8mm

FP—

Package_BGA

UFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f446ze.pdf#page=189

Pads
144
SMD
12.0×12.0
Boards
1

LFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mm

FP—

Package_CSP

LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf)

Pads
73
SMD
11.3×11.3
Boards
1

LQFP-52_10x10mm_P0.65mm

FP3D

Package_QFP

LQFP, 52 Pin (https://www.nxp.com/docs/en/package-information/98ARL10526D.pdf)

Pads
52
SMD
13.3×13.3
Boards
1

LQFP-64-1EP_10x10mm_P0.5mm_EP6.5x6.5mm_ThermalVias

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/98ARH98426A.pdf)

Pads
65
SMD
13.3×13.3
Boards
1

CAP ALSMD ELEC 10.3MM H10MM

FP—

celestial-altium-Capacitor_Aluminium

Aluminum SMD Electrolytic Capacitor, 10.30mm Land Size, 10.00mm Diameter, 10.00mm Height, 10.90mm Maximum Leads Span

Pads
2
SMD
13.8×10.7
Boards
—