Footprints
21 footprints matching “18mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SW_DIP_SPSTx03_Slide_6.7x9.18mm_W8.61mm_P2.54mm_LowProfile
Button_Switch_SMD
SMD 3x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x9.18mm (see e.g. https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile
- Pads
- 6
- SMD
- 11.6×9.8
- Boards
- 14
SW_DIP_SPSTx03_Slide_6.7x9.18mm_W6.73mm_P2.54mm_LowProfile_JPin
Button_Switch_SMD
SMD 3x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size 6.7x9.18mm (see e.g. https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin
- Pads
- 6
- SMD
- 9.4×9.8
- Boards
- 4
CAP ALSMD ELEC 18MM H21MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 18.00mm Land Size, 18.00mm Diameter, 21.00mm Height, 21.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 25.9×18.4
- Boards
- —
CAP ALSMD ELEC 18MM H22MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 18.00mm Land Size, 18.00mm Diameter, 22.00mm Height, 21.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 25.9×18.4
- Boards
- —
CAP ALSMD ELEC 19MM H16.5MM CAPD18MM
celestial-altium-Capacitor_Aluminium
Aluminum SMD Electrolytic Capacitor, 19.00mm Land Size, 18.00mm Diameter, 16.50mm Height, 21.00mm Maximum Leads Span
- Pads
- 2
- SMD
- 26.2×19.4
- Boards
- —
TFBGA-252_12x18mm_Layout14x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 252 balls (JEDEC MO-210Q), 18.0x12.0mm, 252 Ball, 14x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 252
- SMD
- 14.0×20.0
- Boards
- —
TFBGA-272_14x18mm_Layout16x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 272 balls (JEDEC MO-210Q), 18.0x14.0mm, 272 Ball, 16x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 272
- SMD
- 16.0×20.0
- Boards
- —
TFBGA-316_14x18mm_Layout16x22_P0.8mm_Ball0.45mm_Pad0.35mm_NSMD
gekkio-Gekkio_Package_BGA
TFBGA, 316 balls (JEDEC MO-210Q), 18.0x14.0mm, 316 Ball, 16x22 Layout, 0.8mm Pitch, https://www.jedec.org/standards-documents/docs/mo-210n
- Pads
- 316
- SMD
- 16.0×20.0
- Boards
- —
Sharp_SOIC-28W_8.6x18mm_P1.27mm
gekkio-Gekkio_Package_SO
Sharp SOIC, 28 Pin (Sharp Microcomputer Databook 1996), generated with kicad-footprint-generator ipc_gullwing_generator.py
- Pads
- 28
- SMD
- 13.5×18.5
- Boards
- —
BGA-100_12x18mm_Layout10x17_P1mm
Package_BGA
BGA-100, 12x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 100
- SMD
- 14.0×20.0
- Boards
- —
BGA-100_14x18mm_Layout10x17_P1mm
Package_BGA
BGA-100, 14x18mm, 100 Ball, 10x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 100
- SMD
- 16.0×20.0
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1.0mm
Package_BGA
BGA-132 11x17 12x18mm 1.0pitch
- Pads
- 132
- SMD
- 13.0×19.0
- Boards
- —
BGA-132_12x18mm_Layout11x17_P1mm
Package_BGA
BGA-132, 12x18mm, 132 Ball, 11x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 132
- SMD
- 14.0×20.0
- Boards
- —
BGA-152_14x18mm_Layout13x17_P0.5mm
Package_BGA
BGA-152_14x18mm_Layout13x17_P0.5mm
- Pads
- 152
- SMD
- 16.0×20.0
- Boards
- —
BGA-152_14x18mm_Layout13x17_P1mm
Package_BGA
BGA-152, 14x18mm, 152 Ball, 13x17 Layout, 1mm Pitch, https://www.jedec.org/system/files/docs/MO-304D.pdf
- Pads
- 152
- SMD
- 16.0×20.0
- Boards
- —
LFBGA-169_12x18mm_Layout14x28_P0.5mm
Package_BGA
JEDEC eMMC AB BGA-169, 12.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 169
- SMD
- 14.0×20.0
- Boards
- —
LFBGA-169_14x18mm_Layout14x28_P0.5mm
Package_BGA
JEDEC eMMC AC BGA-169, 14.0x18.0mm, 169 Ball, 14x28 Layout, 0.5mm Pitch, https://www.jedec.org/sites/default/files/docs/MO-276F.pdf
- Pads
- 169
- SMD
- 16.0×20.0
- Boards
- —
LFBGA-484_18x18mm_Layout22x22_P0.8mm
Package_BGA
LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 484
- SMD
- 20.0×20.0
- Boards
- —
ST_LFBGA-448_18x18mm_Layout22x22_P0.8mm
Package_BGA
ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf
- Pads
- 448
- SMD
- 20.0×20.0
- Boards
- —
ST_TFBGA-436_18x18mm_Layout22x22_P0.8mm
Package_BGA
ST TFBGA-436, 18.0x18.0mm, 436 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=222
- Pads
- 436
- SMD
- 20.0×20.0
- Boards
- —
pSemi_CSP-16_1.64x2.04mm_P0.4mm_Pad0.18mm
Package_CSP
pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf)
- Pads
- 16
- SMD
- 2.1×2.5
- Boards
- —