Footprints
14 footprints matching “484”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Xilinx_FGG484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- 3
BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
BGA-484, https://www.xilinx.com/support/documentation/package_specs/fg484.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- 1
XILINX ZYNQ-7000 XC7Z020-CLG484
celestial-altium-Leadless_BGA
BGA, 484-Leads, Body 19.00x19.00mmx1.60mm, Pitch 0.80mm
- Pads
- 484
- SMD
- 19.5×19.5
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
LFBGA-484_18x18mm_Layout22x22_P0.8mm
Package_BGA
LFBGA-484, NSMD, 18.0x18.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.efinixinc.com/docs/titanium-packaging-ug-v5.2.pdf
- Pads
- 484
- SMD
- 20.0×20.0
- Boards
- —
Microchip_FCVG484_BGA-484_19x19mm_Layout22x22_P0.8mm
Package_BGA
FCVG484, 19.0x19.0mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://ww1.microchip.com/downloads/aemDocuments/documents/FPGA/ProductDocuments/UserGuides/microchip_polarfire_soc_fpga_packaging_and_pin_descriptions_user_guide_vb.pdf
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_CLG484_CLG485
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_FBG484
Package_BGA
Artix-7, Kintex-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Xilinx_FGGA484
Package_BGA
Spartan-7 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Xilinx_RB484
Package_BGA
Artix-7 and Zynq-7000 BGA, NSMD pad definition Appendix A, 23x23mm, 484 Ball, 22x22 Layout, 1mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Xilinx_RS484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_SBG484
Package_BGA
Artix-7 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
Xilinx_SBG485
Package_BGA
Zynq-7000 BGA, NSMD pad definition Appendix A, 19x19mm, 484 Ball, 22x22 Layout, 0.8mm Pitch, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80
- Pads
- 484
- SMD
- 21.0×21.0
- Boards
- —
ST_WLCSP-80_3.5x3.27mm_Layout10x16_P0.35mm_Stagger_Offcenter
Package_CSP
ST WLCSP-80, ST die ID 484, 3.5x3.27mm, 80 Ball, Y-staggered 10x16 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h563mi.pdf
- Pads
- 80
- SMD
- 5.5×5.3
- Boards
- —