Footprints
18 footprints matching “48mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
Package_DFN_QFN
UDFN-4_1x1mm_P0.65mm, http://ww1.microchip.com/downloads/en/DeviceDoc/MIC550x-300mA-Single-Output-LDO-in-Small-Packages-DS20006006A.pdf
- Pads
- 5
- SMD
- 1.8×1.5
- Boards
- 12
DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
Package_DFN_QFN
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 11
- SMD
- 4.3×3.7
- Boards
- 11
SMDIP-8_W11.48mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 8
- SMD
- 14.0×10.7
- Boards
- 2
Texas_X2SON-5_0.8x0.8mm_P0.48mm
Package_SON
X2SON 5 pin 0.8x0.8mm package (Reference Datasheet: https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=39 Reference part: SN74LVC1G17) [StepUp generated footprint]
- Pads
- 5
- SMD
- 1.8×1.3
- Boards
- 2
WLP-9_1.468x1.448mm_Layout3x3_P0.4mm
Package_BGA
WLP-9, 1.468x1.448mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF
- Pads
- 9
- SMD
- 3.5×3.5
- Boards
- —
ST_WLCSP-25_2.3x2.48mm_Layout5x5_P0.4mm
Package_CSP
ST WLCSP-25, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf
- Pads
- 25
- SMD
- 4.3×4.5
- Boards
- —
SMDIP-10_W11.48mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 10
- SMD
- 14.0×13.2
- Boards
- —
SMDIP-12_W11.48mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 12
- SMD
- 14.0×15.7
- Boards
- —
SMDIP-14_W11.48mm
Package_DIP
14-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 14
- SMD
- 14.0×18.3
- Boards
- —
SMDIP-16_W11.48mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 16
- SMD
- 14.0×20.8
- Boards
- —
SMDIP-18_W11.48mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 18
- SMD
- 14.0×23.4
- Boards
- —
SMDIP-20_W11.48mm
Package_DIP
20-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 20
- SMD
- 14.0×25.9
- Boards
- —
SMDIP-22_W11.48mm
Package_DIP
22-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 22
- SMD
- 14.0×28.4
- Boards
- —
SMDIP-24_W11.48mm
Package_DIP
24-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 24
- SMD
- 14.0×31.0
- Boards
- —
SMDIP-32_W11.48mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 32
- SMD
- 14.0×41.2
- Boards
- —
SMDIP-4_W11.48mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 4
- SMD
- 14.0×5.6
- Boards
- —
SMDIP-6_W11.48mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 6
- SMD
- 14.0×8.1
- Boards
- —
Texas_X2SON-5_0.8x0.8mm_P0.48mm_RoutingVia
Package_SON
X2SON 5 pin 0.8x0.8mm package (Reference Datasheet: https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=39 Reference part: SN74LVC1G17) [StepUp generated footprint]
- Pads
- 5
- SMD
- 1.8×1.3
- Boards
- —