Footprints

22 footprints matching “CAS”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

22 footprints

Matched by name and keywords. Search by meaning instead

LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

Nidec_Copal_CAS-120A

FP—

Button_Switch_SMD

Slide Switch, SMD, Nidec CAS series, https://www.nidec-components.com/e/catalog/switch/cas.pdf

Pads: 3
SMD: 4.4×5.9
Boards: 16

OnSemi_CASE100CY

FP3D

OptoDevice

OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF

Pads: 4
SMD: 3.7×6.2
Boards: 9

ONSemi_SO-8FL_488AA

FP—

Package_SO

ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF

Pads: 5
SMD: 7.0×6.1
Boards: 9

TQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 128
SMD: 17.3×17.3
Boards: 4

PQFP-80_14x20mm_P0.8mm

FP3D

Package_QFP

PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)

Pads: 80
SMD: 18.5×24.5
Boards: 3

TQFP-64_7x7mm_P0.4mm

FP3D

Package_QFP

TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)

Pads: 64
SMD: 10.3×10.3
Boards: 1

ON SEMI SOIC-14 CASE 751A-03

FP—

celestial-altium-Leaded_SOIC

SOIC-14 CASE 751A-03, 14-Leads, Body 8.75x4.0mm, Pitch 1.27mm, IPC Medium Density

Pads: 14
SMD: 7.0×9.0
Boards: —

ONSEMI - SOIC8 CASE 751EB-A

FP—

celestial-altium-Leaded_SOIC

SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density

Pads: 8
SMD: 7.8×5.5
Boards: —

ONSEMI TSOT-5 CASE483P

FP—

celestial-altium-Leaded_SOT_23

SOT23, 5-Leads, Body 3.00x2.75mm, Pitch 0.95mm

Pads: 5
SMD: 4.0×3.6
Boards: —

ONSEMI DFN-10 3X3 CASE 485P

FP—

celestial-altium-Leadless_DFN

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm

Pads: 11
SMD: 3.8×3.6
Boards: —

ONSEMI XDFN6 1.2x1.2 0.40P CASE 711AT C

FP—

celestial-altium-Leadless_DFN

XDFN6, 6-Leads, Body 1.20x1.20mm, Pitch 0.40mm, Thermal Pad 0.94x0.22mm

Pads: 7
SMD: 1.8×1.6
Boards: —

ONSEMI QFN15 4X4 CASE 485FN B

FP—

celestial-altium-Leadless_QFN

QFN, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, IPC Medium Density

Pads: 15
SMD: 5.0×5.0
Boards: —

VISHAY ACAS 0606 AT

FP—

celestial-altium-Resistor_Array

Chip Resistor Array

Pads: 4
SMD: 2.2×1.8
Boards: —

C_CASE-A-3216-18(mm)

FP—

jlcpcb-JLCPCB

Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator

Pads: 2
SMD: 4.6×2.1
Boards: —

C_CASE-B-3528-21(mm)

FP—

jlcpcb-JLCPCB

Tantalum Capacitor SMD Kemet-B (3528-21 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator

Pads: 2
SMD: 4.9×3.3
Boards: —

LQFP-176_20x20mm_P0.4mm

FP3D

Package_QFP

LQFP, 176 Pin (JEDEC MS-026 variation BFC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 176
SMD: 23.3×23.3
Boards: —

Mini-Circuits_HZ1198_LandPatternPL-247

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-247, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf)

Pads: 6
SMD: 23.5×14.5
Boards: —

Astrocast_AST50147-00

FP—

RF_Module

L-band satellite communication module, https://docs.astrocast.com/dl/0532-DOC-M2M-ASTRO-Astronode_S-Datasheet.pdf

Pads: 38
SMD: 32.5×35.5
Boards: —