Footprints

62 footprints matching “CASE”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

62 footprints · page 1 of 3

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LQFP-48_7x7mm_P0.5mm

FP3D

Package_QFP

LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)

Pads: 48
SMD: 10.3×10.3
Boards: 862

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

TQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)

Pads: 100
SMD: 17.3×17.3
Boards: 93

LQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

LQFP, 44 Pin (JEDEC MS-026 variation BCB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.nxp.com.cn/docs/en/package-information/98ASS23225W.pdf)

Pads: 44
SMD: 13.3×13.3
Boards: 27

DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm

FP3D

Package_DFN_QFN

DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)

Pads: 9
SMD: 2.8×2.5
Boards: 20

Mini-Circuits_CD542_LandPatternPL-052

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf)

Pads: 6
SMD: 9.9×8.4
Boards: 11

DFN-6-1EP_3x3mm_P0.95mm_EP1.7x2.6mm

FP3D

Package_DFN_QFN

DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)

Pads: 7
SMD: 3.8×3.7
Boards: 10

OnSemi_CASE100CY

FP3D

OptoDevice

OnSemi CASE 100CY, light-direction upwards, see http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF

Pads: 4
SMD: 3.7×6.2
Boards: 9

ONSemi_SO-8FL_488AA

FP—

Package_SO

ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF

Pads: 5
SMD: 7.0×6.1
Boards: 9

Mini-Circuits_CD636_LandPatternPL-035

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf)

Pads: 6
SMD: 8.1×8.4
Boards: 6

TQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 128
SMD: 17.3×17.3
Boards: 4

Mini-Circuits_GP731

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf)

Pads: 8
SMD: 10.4×10.4
Boards: 4

PQFP-80_14x20mm_P0.8mm

FP3D

Package_QFP

PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)

Pads: 80
SMD: 18.5×24.5
Boards: 3

Mini-Circuits_DB1627

FP—

RF_Mini-Circuits

Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf)

Pads: 6
SMD: 4.3×5.3
Boards: 3

Mini-Circuits_HQ1157

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf)

Pads: 14
SMD: 10.8×36.1
Boards: 3

Mini-Circuits_FG873-4_3x3mm

FP3D

Package_DFN_QFN

Mini Circuits Case style FG (https://ww2.minicircuits.com/case_style/FG873.pdf)

Pads: 4
SMD: 5.2×5.2
Boards: 1

TQFP-64_7x7mm_P0.4mm

FP3D

Package_QFP

TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)

Pads: 64
SMD: 10.3×10.3
Boards: 1

Mini-Circuits_HF1139_LandPatternPL-230

FP—

RF_Mini-Circuits

Footprint for Mini-Circuits case HF1139 (https://ww2.minicircuits.com/case_style/HF1139.pdf) following land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf)

Pads: 8
SMD: 14.2×19.3
Boards: 1