Footprints
16 footprints matching “DEV”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Olimex_MOD-WIFI-ESP8266-DEV
Module
ESP8266 development board https://www.olimex.com/Products/IoT/ESP8266/MOD-WIFI-ESP8266-DEV/resources/dimensions-WIFI-ESP8266-DEV.png
- Pads
- 22
- SMD
- 26.4×34.0
- Boards
- 1
ANALOG DEVICES TQFP_EP-100 SV-100-1
celestial-altium-Leaded_LQFP
TQFP_EP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, Thermal Pad 6.50x6.50mm, IPC Medium Density
- Pads
- 101
- SMD
- 17.3×17.3
- Boards
- —
ANALOG DEVICES SC70-6 KS-6
celestial-altium-Leaded_SC_70
SOT23, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm
- Pads
- 6
- SMD
- 3.6×2.6
- Boards
- —
ANALOG DEV SOIC-14 R-14
celestial-altium-Leaded_SOIC
SOIC, 14-Leads, Body 8.65x3.90mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 14
- SMD
- 7.4×9.3
- Boards
- —
ANALOG DEV SOIC-16 RI-16-1
celestial-altium-Leaded_SOIC
SOIC, 16-Leads, Body 12.80x7.50mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 16
- SMD
- 12.0×13.2
- Boards
- —
ANALOG DEV SOIC-8 R8
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
ANALOG DEVICES SOT-23-6 RJ-6
celestial-altium-Leaded_SOT_23
SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm
- Pads
- 6
- SMD
- 4.2×3.4
- Boards
- —
ANALOG DEV DFN-10 3X3MM DD
celestial-altium-Leadless_DFN
DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.65x2.38mm, IPC Medium Density
- Pads
- 11
- SMD
- 4.0×3.9
- Boards
- —
ANALOG DEVICES HMC637ALP5E
celestial-altium-Leadless_QFN
QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.70x3.70mm, IPC Medium Density
- Pads
- 13
- SMD
- 6.2×6.2
- Boards
- —
ANALOG DEVICES LFCSP-20 CP-20-8
celestial-altium-Leadless_QFN
LFCSP, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.55x2.55mm
- Pads
- 21
- SMD
- 5.0×5.0
- Boards
- —
ANALOG DEVICES QFN-52 UKG 05-08-1729
celestial-altium-Leadless_QFN
QFN, 52-Leads, Body 7.00x8.00mm, Pitch 0.50mm, Thermal Pad 5.41x6.45mm
- Pads
- 53
- SMD
- 7.8×8.8
- Boards
- —
A20_OLINUXINO_LIME2
Module
A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet
- Pads
- 180
- SMD
- 90.0×60.5
- Boards
- —
Carambola2
Module
8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf
- Pads
- 52
- SMD
- 30.9×40.9
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
Analog_KS-4
Package_TO_SOT_SMD
Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf
- Pads
- 4
- SMD
- 3.0×2.8
- Boards
- —