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Footprints

27 footprints matching “Devices”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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27 footprints · page 1 of 2

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Analog_LCC-8_5x5mm_P1.27mm

FP3D

Package_LCC

LCC, ceramic leaded chip carrier, 8 pins, surface mount, Analog Devices LS8, 5x5mm, height 1.45mm, https://www.analog.com/media/en/technical-documentation/data-sheets/ltc6655-6655ln.pdf

Pads
8
SMD
6.3×6.4
Boards
4

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads
29
SMD
5.3×5.3
Boards
2

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads
49
SMD
10.3×10.3
Boards
2

ANALOG DEVICES TQFP_EP-100 SV-100-1

FP—

celestial-altium-Leaded_LQFP

TQFP_EP, 100-Leads, Body 14.00x14.00mm, Pitch 0.50mm, Thermal Pad 6.50x6.50mm, IPC Medium Density

Pads
101
SMD
17.3×17.3
Boards
—

ANALOG DEVICES SC70-6 KS-6

FP—

celestial-altium-Leaded_SC_70

SOT23, 6-Leads, Body 2.00x2.10mm, Pitch 0.65mm

Pads
6
SMD
3.6×2.6
Boards
—

ANALOG DEVICES SOT-23-6 RJ-6

FP—

celestial-altium-Leaded_SOT_23

SOT23, 6-Leads, Body 2.90x2.80mm, Pitch 0.95mm

Pads
6
SMD
4.2×3.4
Boards
—

ANALOG DEVICES HMC637ALP5E

FP—

celestial-altium-Leadless_QFN

QFN, 32-Leads, Body 5.00x5.00mm, Pitch 0.50mm, Thermal Pad 3.70x3.70mm, IPC Medium Density

Pads
13
SMD
6.2×6.2
Boards
—

ANALOG DEVICES LFCSP-20 CP-20-8

FP—

celestial-altium-Leadless_QFN

LFCSP, 20-Leads, Body 4.00x4.00mm, Pitch 0.50mm, Thermal Pad 2.55x2.55mm

Pads
21
SMD
5.0×5.0
Boards
—

ANALOG DEVICES QFN-52 UKG 05-08-1729

FP—

celestial-altium-Leadless_QFN

QFN, 52-Leads, Body 7.00x8.00mm, Pitch 0.50mm, Thermal Pad 5.41x6.45mm

Pads
53
SMD
7.8×8.8
Boards
—

ESP32-S31-WROOM-3

FP—

espressif-Espressif

Built-in ESP32-S31 series chip, featuring a RISC-V 32-bit dual-core microprocessor, suitable for embedded systems, smart home, wearable electronic devices, and other IoT scenarios

Pads
99
SMD
22.5×30.5
Boards
—

Carambola2

FP—

Module

8devices Carambola2, OpenWRT, industrial SoM computer, https://www.8devices.com/media/products/carambola2/downloads/carambola2-datasheet.pdf

Pads
52
SMD
30.9×40.9
Boards
—

Analog_BGA-77_9x15mm_Layout7x11_P1.27mm

FP3D

Package_BGA

Analog Devices BGA-77, 0.63mm pad, 9x15mm, 77 Ball, 7x11 Layout, 1.27mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081964_B_bga77.pdf

Pads
77
SMD
11.0×17.0
Boards
—

Linear_BGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_BGA

Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads
134
SMD
17.0×17.0
Boards
—

Analog_LFCSP-8-1EP_3x3mm_P0.5mm_EP1.53x1.85mm

FP—

Package_CSP

LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf)

Pads
5
SMD
4.0×3.5
Boards
—

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads
29
SMD
6.2×6.2
Boards
—

VQFN-28-1EP_5x5mm_P0.5mm_EP3.7x3.7mm_ThermalVias

FP—

Package_DFN_QFN

VQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation VHHD-3 and exposed pad nominal size from ADI Trinamic / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/technical-documentation/data-sheets/TMC2209_datasheet_rev1.09.pdf#page=83)

Pads
29
SMD
6.2×6.2
Boards
—

WQFN-28-1EP_4x4mm_P0.4mm_EP2.7x2.7mm_ThermalVias

FP—

Package_DFN_QFN

WQFN, 28 Pin (Based on JEDEC MO-220-K.01 variation WGGE and exposed pad from Maxim / Analog Devices, https://www.jedec.org/system/files/docs/MO-220K01.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfn/21-0139.pdf)

Pads
29
SMD
5.3×5.3
Boards
—

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads
39
SMD
6.2×8.2
Boards
—

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads
39
SMD
6.2×8.2
Boards
—

Linear_LGA-133_15.0x15.0mm_Layout12x12_P1.27mm

FP—

Package_LGA

Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf

Pads
133
SMD
15.5×15.5
Boards
—

Microchip_PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)

Pads
44
SMD
15.4×15.4
Boards
—

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads
49
SMD
10.3×10.3
Boards
—

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads
81
SMD
17.4×17.4
Boards
—

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads
81
SMD
17.4×17.4
Boards
—