Footprints

6,968 footprints matching “I”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

6,968 footprints · page 1 of 291

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InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74

Infineon_PG-DSO-12-11

FP—

Package_SO

Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/)

Pads: 13
SMD: 12.1×8.6
Boards: 12

IDC-Header_2x03_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 6
SMD: 13.6×16.3
Boards: 10

Infineon_PG-TSNP-6-10_0.7x1.1mm_0.7x1.1mm_P0.4mm

FP—

Package_LGA

6 lead, 1.1x0.7mm body, 0.37mm height, TSNP (https://www.infineon.com/cms/en/product/packages/PG-TSNP/PG-TSNP-6-10/)

Pads: 6
SMD: 1.2×1.6
Boards: 9

Infineon_PG-TDSON-8_6.15x5.15mm

FP—

Package_SON

Infineon, PG-TDSON-8, 6.15x5.15x1mm, https://www.infineon.com/dgdl/Infineon-BSC520N15NS3_-DS-v02_02-en.pdf?fileId=db3a30432239cccd0122eee57d9b21a4

Pads: 5
SMD: 7.4×5.6
Boards: 9

Infineon_PG-LLGA-5-1

FP—

Sensor_Audio

Infineon_PG-LLGA-5-1 StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/

Pads: 5
SMD: 4.5×3.5
Boards: 7

Infineon_PG-HSOF-8-1

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

Infineon_PG-HSOF-8-1_ThermalVias

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

IDC-Header_2x08_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 16
SMD: 13.6×28.9
Boards: 5

IDC-Header_2x05_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 10
SMD: 13.6×21.3
Boards: 4

Infineon_PG-TSDSO-14-22

FP—

Package_SO

Infineon_PG-TSDSO-14-22

Pads: 15
SMD: 7.5×5.4
Boards: 4

Infineon_PG-DSO-12-9

FP—

Package_SO

Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/)

Pads: 13
SMD: 12.1×8.6
Boards: 3

Infineon_PG-DSO-8-27_3.9x4.9mm_EP2.65x3mm

FP—

Package_SO

Infineon PG-DSO, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27)

Pads: 9
SMD: 7.4×5.4
Boards: 3

Infineon_PG-DSO-8-43

FP—

Package_SO

Infineon_PG-DSO-8-43

Pads: 9
SMD: 7.5×5.5
Boards: 2

Infineon_PG-TISON-8-5

FP—

Package_SON

Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/

Pads: 8
SMD: 9.4×9.5
Boards: 2

Infineon_PG-LLGA-5-2

FP—

Sensor_Audio

Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500

Pads: 5
SMD: 4.5×3.5
Boards: 2

IDC-Header_2x04_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 8
SMD: 13.6×18.8
Boards: 1

IDC-Header_2x07_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x07, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 14
SMD: 13.6×26.4
Boards: 1

IDC-Header_2x10_P2.54mm_Vertical_SMD

FP3D

Connector_IDC

SMD IDC box header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf

Pads: 20
SMD: 13.6×34.0
Boards: 1

IHI_B6A-PCB-45_Vertical

FP—

Connector

https://lugsdirect.com/PDF_Webprint/B6A-PCB-45-XX(-X).pdf

Pads: 1
SMD: 15.7×10.8
Boards: 1

Infineon_SG-WLL-2-3_0.58x0.28_P0.36mm

FP3D

Diode_SMD

Infineon SG-WLL-2-3, 0.58x0.28x0.15mm, https://www.infineon.com/dgdl/Infineon-SG-WLL-2-3_SPO_PDF-Package-v02_00-EN.pdf?fileId=5546d46271bf4f9201723159ce71239d

Pads: 2
SMD: 1.1×0.8
Boards: 1