Footprints
14 footprints matching “NB”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
SOIC-10_3.9x4.9mm_P1mm
Package_SO
SOIC, 10 Pin (https://www.onsemi.com/pub/Collateral/751BQ.PDF)
- Pads
- 10
- SMD
- 7.4×5.4
- Boards
- 2
Quectel_BC66
RF_GSM
GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf
- Pads
- 58
- SMD
- 21.8×23.7
- Boards
- 2
Winbond_USON-8-2EP_3x4mm_P0.8mm_EP0.2x0.8mm
Package_SON
Winbond USON, 8 Pin (https://www.winbond.com/hq/support/documentation/levelOne.jsp?__locale=en&DocNo=DA00-W25Q16JV.1#page=69), generated with kicad-footprint-generator ipc_noLead_generator.py
- Pads
- 9
- SMD
- 4.3×4.5
- Boards
- 1
Quectel_BG95
RF_GSM
Quectel BG95 Cellular GSM NB-IoT Module https://images.quectel.com/python/sites/2/2023/05/Quectel_BG95_Series_QuecOpen_Hardware_Design_V1.3.pdf
- Pads
- 102
- SMD
- 21.9×25.6
- Boards
- 1
WINBOND SOIC-8
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 4.90x3.90mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
WINBOND SOIC-8 208MIL WIDE
celestial-altium-Leaded_SOIC
SOIC, 8-Leads, Body 5.28x5.28mm, Pitch 1.27mm, IPC Medium Density
- Pads
- 8
- SMD
- 9.3×5.9
- Boards
- —
WINBOND TSOP-54L TYPE2 400MIL
celestial-altium-Leaded_SOP
TSOP, 54-Leads, Body 22.22x10.16mm, Pitch 0.80mm, IPC Medium Density
- Pads
- 54
- SMD
- 13.2×22.9
- Boards
- —
MICROCHIP SOT-23-3 NB
celestial-altium-Leaded_SOT_23
SOT23, 3-Leads, Body 2.86x2.37mm, Pitch 0.95mm, IPC Medium Density
- Pads
- 3
- SMD
- 3.9×3.6
- Boards
- —
WINBOND WSON-8 6x5mm
celestial-altium-Leadless_SON
SON, 8-Leads, Body 5.00x6.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 7.2×5.6
- Boards
- —
WINBOND WSON-8 8x6MM E
celestial-altium-Leadless_SON
WSON, 8-Leads, Body 6.00x8.00mm, Pitch 1.27mm, Thermal Pad 4.30x3.40mm, IPC Medium Density
- Pads
- 9
- SMD
- 9.2×6.6
- Boards
- —
Abracon_PRO-OB-471
RF_Antenna
OnBoard 868/915/868+2400 MHz Antenna, https://abracon.com/datasheets/PRO-OB-471.pdf
- Pads
- 6
- SMD
- 34.5×12.1
- Boards
- —
Quectel_BC95
RF_GSM
GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf
- Pads
- 94
- SMD
- 28.0×31.7
- Boards
- —